PB-FREE SOLDERPURPOSE: To improve mechanical strength and creep resistance while maintaining excellent characteristics of Sn-Ag solder.SANGO JINサンゴ ジンMAAKU TOOMASU MATSUKOOMATSUKUマーク トーマス マッコーマック
无铅焊料镀层,Pb-free solder... ... ) lead-free coating 无铅镀层 )Pb-free solder无铅焊料) lead-free solder 无铅焊料 ... www.dictall.com|基于7个网页 2. 锡铟无铅焊料 ...n-GaN)之欧姆接触,以及光电构装中之块材界面:锡铟无铅焊料(Pb-free solder)与铜、镍界面之反应与电迁移效应(electromig…...
Pb-Free Solder Fabrications-pds ®Solder Spheres Indium Corporation’s unique manufacturing process produces bright and shiny solder spheres supported by Statistical Quality Control systems. Capabilities range from .004” (.10mm) to .095” (2.41mm). All solder spheres can be manufactured ...
Pb-Free Solder Wire 下载积分: 100 内容提示: A L P H A T E C H N I C A L B U L L E T I N Telecore Plus Core Sn/Ag/Cu Solder Wire p.1 Date: 2003.10.3. General description: The solder wire is made by Telecore Plus flux and Sn/Ag/Cu alloy, including SAC305(Sn96.5/Ag...
A Pb-free solder connection structure and an electronic device, the Pb-free solder connection structure having a sufficient bonding strength was obtained even in the case over time remained stable interface, and to maintain sufficient wettability of whiskers resistance. 特别是,无Pb焊料的特征在于:作为...
求翻译:SOLDER,PASTE,Pb-Free是什么意思?待解决 悬赏分:1 - 离问题结束还有 SOLDER,PASTE,Pb-Free问题补充:匿名 2013-05-23 12:21:38 null 匿名 2013-05-23 12:23:18 焊料, 粘贴 , 无铅 匿名 2013-05-23 12:24:58 正在翻译,请等待... 匿名 2013-05-23 12:26:38 无铅焊料,粘贴, ...
A single printed circuit board includes thousands, sometimes even hundreds of thousands, of solder joints. The failure of even a single solder joint is usually enough to compromise the functionality of an electronic device or system. PbSn solder had been the standard ma te rial for these joints...
indium8.9_pbfree_solder_paste_98319_a4_r12 OVER—>Features •High transfer efficiency through small apertures (≤ 0.66AR) •Excellent wetting to all common finishes at high and low peak reflow temperatures •Clear, probe testable flux residue •Eliminates head-in-pillow defects Introductio...
Product Name:Solder Bar;Material:Sn99.3/Cu0.7;Shape:Trapezoid Bar;Type:Lead Free Solder Bar;Feature:Good wetting, bright point, low residue;Melting Point:217~227℃;Dimensions:(L)34±0.5cm (W)2.25±0.25cm(H)2.0±0.2cm;Color:Sliver;Certification:Reach, RoH
A variety of lead-free solder alloys were studied for use as flip-chip interconnects including Sn-3.5Ag, Sn-0.7Cu, Sn-3.8Ag-0.7Cu, and eutectic Sn-37Pb as a baseline. The reaction behavior and reliability of these solders were determined in a flip-chip configuration using a variety of un...