PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy low in the residual stress upon solidification, having a high bonding strength and high reliability, and capable of suppressing the reaction of Ni with Bi and diffusion of Ni when bonding an electronic component or a substrate each ...
‧PB2D-3JLA-viewing angle 35°qualifies as the JEDEC Level 1 MSL sensitivity level and suitable for SMD process, Pb_free reflow soldering capability, and full compliance with EU Reduction of Hazardous Substances (RoHS) legislation.Features ‧100% foot print compatible with Cree XP-C / XP-E...
In this chapter, the research background and progress on Pb-free soldering are reviewed. Soldering is the most widely joining technology in microelectronic package, and Pb-free solders were proposed to replace the Sn–Pb solder out of environmental...
Imaging of failed solder bumps after high stress EM testing linking lifetime data and rapid changes in the solder bump test vehicle will provide direction for high-reliability solder bump design and materials. 展开 关键词: Electromigration thermomigration solder ball lead free SAC alloy WLCSP ...
Effects of Physical Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders Solder materials demonstrate evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such ... H Ma,JC Suhling,P Lall,... - International Symposium...
Total of low level Total of medium level Total of high level Tin-lead solder paste Separation Squeeze Squeeze speed pressure speed -3.86 -5.45 -1.59 -2.43 -2.86 -3.16 -5.43 -3.42 -6.98 Lead-free solder paste Separation Squeeze Squeeze speed pressure speed -10.13 -7.73 -10.42 -9.79 -7.60 ...
Pb-FREE ALLOY ALTERNATIVES: RELIABILITY INVESTIGATION H.-J. Albrecht, P. Frühauf, and K. Wilke Siemens AG Berlin, Germany hans-juergen.albrecht@siemens.com ABSTRACT The paper compares different solder compositions and micro alloyed SAC solders in terms of assembly and mechanical / thermal fatigue ...
A050408-2 Thermal-Links (Thermal Cutoffs) Pb-free&Cd-free E Series Part Number Type Number Functioning Electrical Ratings Tf (℃) Temperature AC/ Voltage Current (℃) DC (V) (A) Th (℃) Approved Safety standards Tm (℃) UL BE PSE C-UL CSA VDE AB CCC EYP05BE115 E115 115 EYP...
Chip Enable (Active Low). Note that this pin is high impedance. There should be a pull high 100kΩ r esistor connected to VIN when the control signal is floating. No Internal Connection. Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power ...
AEC - Q005 Rev - A - Pb-Free Test Requirements无铅测试要求.pdf,AEC - Q005 - REV-A June 1, 2010 Automotive Electronics Council Component Technical Committee AEC – Q005 - REV- PB-FREE TEST REQUIREMENTS AEC - Q005 - REV-A June 1, 2010 Automotive Electronic