Glazer,J.Metallurgy of Low Temperature Pb-free Solders for Electronic Assembly. International Management . 1995J. Glazer, Metallurgy of low temperature Pb-free solders for electronic assembly, International Materials Reviews, Vol. 40 (2), pp. 65–93, 1995....
Feature Good welding performance/Performance of the temperature/Less residue, shinny and clean solder spot. Place of origin Dongguan,Guangdong Welding method manual welding, automatic soldering Related Products Lead-free solder wire Tin-lead solder wire Solder paste Solder b...
properties for the majority of Pb-Free applications.SAC alloys offer better wetting than the binary eutectic Sn/Cu and Sn/Ag. As wetting speed is a key performance requirement for hand soldering, SAC makes the most sense for solid or cored solder wire . For lower temperature rework with the...
PROBLEM TO BE SOLVED: To reduce a temperature unevenness on a board, to decrease a difference between a liquidus temperature of a using solder and a highest temperature part of the board and to allow to be connectable by moving the board in a reflow furnace by a combination of a linear mo...
PRODUCT DATA SHEET NC-SMQ230 Pb-Free Solder Paste Introduction NC-SMQ230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAgBi, SnAg, and other Pb-free alloy systems favored by the electronics industry to ...
A Pb-free solder composition for high temperature system which consistently suppresses the generation of oxides by the silicon, improves soldering efficiency, and prevents discoloration of a Pb-free solder by containing silicon(Si) and cobalt(Co) in a quaternary Sn-Cu-Ni-P solder composition, and...
Disclosed is a Pb-free solder alloy for use under high-temperature conditions, which has strength at a level required for the bonding between an electronic component and a substrate and also has excellent wettablity and processability. Specifically disclosed is a Pb-free solder alloy for use ...
This article discusses the use of hot air leveled (HAL) solder coatings for lead(Pb)-free assemblies. Most printed-circuit board are hot air leveled. Several factors should be considered when choosing a Pb-free alloy, such as differences in melting temperature. Reasons for the elimination of ...
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Sn42Bi58(30g):Lead-free low temperature solder paste,Melting point: 138°C LED type special non-high temperature resistant board is used, general products are not recommended. KL-558(10cc):Lead free, halogen-free, no resistance, no need to clean, suitable for mobile phone maintenance, BGA ...