A multi-beam mask writer, MBM-2000 is developed for the N3 semiconductor production. It is designed to accomplish high throughput with 16-nm beam and large current density 2.5 A/cm2. It is equipped with curve data format MBF2.0 to allow writing of small curve patterns in EUV masks and ...
In June 2022, the MBMTM-2000PLUS for the 2 nm node device development eventually debuted. The increased beam current density, 3.2 A/cm2 allows this latest mask writer to print a mask with productive writing time even using lower sensitivity resists. A charge effect reduction (CER) is a ...
Multi-beam mask writer MBM-1000 is developed for N5. It is designed to accomplish higher throughput than a single-beam VSB writer EBM-9500 at shot count higher than 500 G/pass, and write masks with low sensitivity resist to have better CDU and patterning resolution. Product version of ...
The multi-beam mask writer MBM-3000 is launched in 2023 for next generation EUV mask production. It is equipped with 12-nm beamlets and a powerful cathode that brings out a beam current density of 3.6 A/cm2, in order to achieve higher resolution and faster writing speed than our current...
Multi-beam mask writer MBM-1000 is developed for N5 semiconductor production. It is designed to accomplish high resolution with 10-nm beam and high throughput with 300-Gbps blanking aperture array (BAA) and inline real-time data path. It has better beam resolution than EBM-9500 and has ...