内容提示: MIL-STD-883G METHOD 2011.7 22 March 1989 1 METHOD 2011.7 BOND STRENGTH (DESTRUCTIVE BOND PULL TEST) 1. PURPOSE. The purpose of this test is to measure bond strengths, evaluate bond strength distributions,
MIL-STD-883G METHOD 2015.13 18 December 2000 1 METHOD 2015.13 RESISTANCE TO SOLVENTS 1. PURPOSE. The purpose of this test is to verify that the markings will not become illegible on the component parts when subjected to solvents. The solvents will not cause deleterious, mechanical or...
mil-std-883g method 2011.7 星级: 6 页 MIL-STD-883G temperature-cycling test 星级: 4 页 N–C–C–N–C–C 星级: 3 页 7 8c c = 9 = 5 c 5:7°c c = 9 = 5 c 5 星级: 10 页 E E C D D C C C D B B C B C C 第三志願 星级: 4 页 SD D Cl) -‘ C ...
MIL-STD-883G METHOD 1010.8 TEMPERATURE CYCLING 1. PURPOSE. This test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes. 1.1 Terms and definitions. 1.1.1 Load. The specimens under test ...
DLA MIL-STD-883 G-2006由美国国防后勤局 US-DLA 发布于 2006-02-28。 DLA MIL-STD-883 G-2006 在中国标准分类中归属于: L55 微电路综合,在国际标准分类中归属于: 31.200 集成电路、微电子学。 DLA MIL-STD-883 G-2006 微电路试验方法标准的最新版本是哪一版?
中文标题(翻译):MIL-STD-883G方法1014.12密封,厂牌:Q-TECH,资料类型:其他,语言:英文资料,生成日期:28 February 2006,文档编码:METHOD 1014.12
MIL-STD-883G-2006是美国国防部发布的标准化文件,专门用于微电路的设计、制造和测试。该标准取代了之前的MIL-STD-883F版本,旨在为微电路的可靠性、性能和质量提供统一的测试方法和规范。该标准涵盖了广泛的测试程序,包括环境测试、机械测试、电气测试和可靠性测试,以确保微电路在各种极端条件下仍能正常工作。 MIL-...
MIL-STD-883G28February2006UPERSEDINGMIL-STD-883F18June2004 DEPARTMENTOFDEFENSE TESTMETHODSTANDARD MICROCIRCUITS AMSCN/AFSC5962 CheckthesourcetoverifythatthisisthecurrentversionbeforeuseMIL-STD-883G FOREWORD 1ThisstandardisapprovedforusebyallDepartmentsandAgenciesoftheDepartmentofDefense ...
MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determinatio...
MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This...