MIL-STD-883J 7 J une 2013 SUPERSEDING MIL-STD-883H 26 February 2010 DEPARTMENT OF DEFENSE TEST METHOD STANDARD MICROCIRCUITS AMSC N/A FSC 5962 This document and process conversion measures necessary to comply with this revision shall be C ompleted by 4 December 2013 INCH - POUND Downloaded...
MIL-STD-883H 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 DEPARTMENT OF DEFENSE TEST METHOD STANDARD MICROCIRCUITS AMSC N/A FSC 5962 The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 September 2010. INCH - POUND ...
TEST METHOD STANDARD MICROCIRCUITS 作废 DLA MIL-STD-883 H-2010 发布历史DLA MIL-STD-883 H-2010 标准号 DLA MIL-STD-883 H-2010 2010年 总页数 729页 发布单位 美国国防后勤局 购买 正式版 GJB 10164-2021微电路模块通用规范SJ 50597/14-1994 混合微电路详细规范HSH91型精密双采样/保持放大器SJ 50597/...
26February2010 SUPERSEDING MIL-STD-883G 28February2006 DEPARTMENTOFDEFENSE TESTMETHODSTANDARD MICROCIRCUITS AMSCN/AFSC5962 Thedocumentationandprocess conversionmeasuresnecessaryto complywiththisrevisionshallbe completedby30September2010. INCH-POUND MIL-STD-883H ...
MIL-STD-883G METHOD1016.1 18June2004 1 METHOD1016.1 LIFE/RELIABILITYCHARACTERIZATIONTESTS 1.PURPOSE.Thepurposeofthelifecharacterizationtestsistodetermine:(1)thelifedistributions,(2)thelife accelerationcharacteristics,and(3)thefailurerate()potentialofthedevices.Foradiscussionoffailureratesandlifetest considerations...
The pending changes to TM 2017 and TM 2032 have been in committee review cycle for more than 5 years. Hybrid Pre Cap inspection (TM 2017) is required just prior to hermetic seal and this method further references the high mag IC die inspect criteria in TM 2010. In addition, TM 2017 als...
Mil Method Reqt. 3.1.1. Wafer Lot Acceptance 5007 All lots N/A --- 3.1.2 Non-destructive Bond Pull 2023 100% N/A --- 3.1.3 Internal Visual Inspection 2010, Test Condition A 100% 2010, Test Condition B 100% 3.1.4 Temperature Cycling 1010, Test Condition C 100% 1010, Test Conditi...
Method 5004 accepts dies which method 2010 rejects for diffusion, passivation and glassivation defects, and foreign material. However, these defects have no impact on the overall reliability of the microcircuits used in this evaluation. These results have led to incorporating Mil-Std-883B method ...
The documentation and process INCH - POUND conversion measures necessary to comply with this revision shall be MIL-STD-883H completed by 30 September 2010. 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 DEPARTMENT OF DEFENSE TEST METHOD STANDARD MICROCIRCUITS AMSC N/A FSC 5962 MIL...
Table 4. Mil-Std-883 Method 5005 Group D (Package-Related) Tests (for all Classes of devices ) Disclaimer:The original document from which the information on this web page were taken, Mil-Std-883 Method 5005, contains many notes that do not appear on this page. Thus, people are advised...