电源SiP直流稳压器 SiP降压直流稳压器模块 电源模块 系统级封装(SiP)电源 降压型电源SiP直流稳压器 电源SiP(System-in-Package)直流稳压器 电源管理 EZ8303 艾诺半导体 本文由ll转载自杭州艾诺半导体有限公司公众号,原文标题为:比贴片电容还小的电源模块——EZ8303,本站所有转载文章系出于传递更多信息之目的,且...
QFN(Quad Flat No-lead Package,方形扁平无引脚封装)是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。由于底部中央大暴露的焊盘被焊接到PCB的散热焊盘上,使得QFN具有极佳的电和热性能。 2019-05-31 10:07:06 QFN封装的特点及焊盘类型及设计事项 ...
Translators per Package 8 Data Rate 100Mbps Bidirectional Yes VCC Shutdown I/O State Hi-Z Icc Max 20uA Shutdown Icc Max 1uA Logic Output Push-Pull Features GPIO Level Shifter 可售卖地 全国 型号 RS0204 技术参数 品牌: 润石科技 型号: RS0204 封装: QFN3.5x3.5-14L 批号: 2021...
FL008AIF with circuit diagram manufactured by SPANSION. The FL008AIF is available in DFN-8 Package, is part of the IC Chips. 技术参数 制造商 包装 Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube RoHs Status Lead free/RoHS Compliant 封装/规格 ...
· Masking: Masking for package manufacturing processes · Surface protection: Protection of CCD glass · Dam: Prevents resin leakage when molding semiconductor packages and electronic components Cautions · Please avoid skin contact, as this could cause rashes. · Please refer to a certified disposal...
QFN32 package, operating junction temperature range from -40 to 125°C 技术规格 通道数 1放大器 电源电压最大值 18V 针脚数 32引脚 芯片安装 表面安装 工作温度最小值 -40°C 产品范围 - MSL MSL 1 -无限制 电源电压最小值 4.5V IC 外壳 / 封装 LQFN 电源开关 内部 芯...
一中科技批发QFN Package Tape TRM-6250L价格:￥628/卷产品详情:一中科技批发QFN Package Tape TRM-6250L NO 6250 QFN package tape ... 用途:QFN封装胶带,EMC/SMC基板耐高温贴膜 货号:6250 品牌:一中科技 厚度:0.03mm 宽度:72/64mm 拉伸性能:35% ...
Single package size: -X-X- cm Single gross weight: 0.100 kg Show more Lead time Know your supplier Shenzhen Rld Technology Co., Ltd. 4 yrsLocated in CN View more productsView profile Product descriptions from the supplier Overview Minimum order quantity: 100 pieces ...
The STEVAL-ISA093V1 is a step-down switching power supply based on STMicroelectronics’ L7981 switching regulator in a QFN package. The L7981 features an embedded power MOSFET and is capable of delivering up to 3 A of current to the load, depending on the application conditions. ...
· Masking: Masking for package manufacturing processes · Surface protection: Protection of CCD glass · Dam: Prevents resin leakage when molding semiconductor packages and electronic components Cautions · Please avoid skin contact, as this could cause rashes. · Please refer to a certified disposal...