Sometimes these pads are exposed on the bottom and both sides. The other package exposes the pad on the chip’s bottom. Also, the QFN package has smaller variants which are TQFN, micro lead (MLF), and VQFN. There are thin-dual no-lead (TDFN) packages and dual no-lead (DFN) ...
Transport PackageCarton Specification10*10*10cm TrademarkFT OriginChina shapeSurface Mount Product Description Product Description The Si4133 is a monolithic integrated circuit that performs both IF and dualband RF synthesis for wireless communications applications. The Si4133 in...
Package:QFN48; Quality:Genuine New Original; shape:hqfp64; Conductive Type:Unipolar Integrated Circuit; Integration:LSI; Technics:Semiconductor IC; shape:32-Vqfn; Conductive Type:Unipolar Integrated Circuit; Integration:LSI; Technics:Semiconductor IC; ...