A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic ...
Electronic circuits are developed using individual or discrete electronic components with different sizes, such that the cost and size of these discrete circuits increase with the number of components used in the circuit. To conquer this negative aspect, the integrated circuit technology was developed ...
QFP packages are commonly used in microcontrollers and other digital ICs. Quad Flat No-Leads Package (QFN): The QFN package does not have pins on the sides. All connections are located at the bottom of the package. An exposed thermal pad on the bottom facilitates heat transfer, and shorter...
QFN Quad Flat Non-leaded package The electrode pad lies along the 4 boundaries of the bottoms. The electrode pad is exposed from the side to the bottom in case the electrode pad is only at the bottom. The mounting area is smaller than QFP, so flat-panelization, density growth is possible...
Package (CSP). And this is due to the fact that it enables you to observe and contact leads after assembly. Typically, the PCB connectivity and die assembly of QFN packages typically comprised of a copper lead frame. In addition, this package may feature a single or numerous row of pins....
packages include: QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), STQFP (Small Thin Quad Plastic Flat Package), FQFP (Fine-pitch Quad Flat Package), (Low profile Quad Flat Package), VQFP (Very-small Quad Flat Package), ETQFP (Exposed thin quad flat-package), PQFN (Power ...
Pin pitch 0.635mm, number of pins 84~196 QFN/LCC (Quad Flat No-Lead Package) The four sides of the IC package are equipped with electrode contacts. Since there are no leads, the mounting area is smaller than QFP, and the height is lower than QFP. The number of electrode contacts is ...
The ‘no leads’ design allows very compact footprint, thin profiles, good thermal and electrical performance. QFNs are often used for processors, ASICs, FPGAs and RF/wireless ICs. BGA – Ball Grid Array Instead of pins or leads, BGA packages have an array of solder balls on the underside...
You can never tell exactly what function a component provides just by looking at its package. This is true for DIP components, QFN components, and small outline transistor (SOT) package types. In particular, SOT packages are commonly used for a variety of components, ranging from discrete trans...
46, QFN (Quad, flat, PACkage, non-leaded) four side flat package without pin. One of surface mount packages. Now its called LCC. QFN is the name of the Japan electronic machinery industry association. The four sides of the package are equipped with electrode contacts. Because of no pin,...