JEDEC JESD22-B108B-2010 下载积分: 2500 内容提示: JEDEC STANDARD Coplanarity Test for Surface-Mount Semiconductor Devices JESD22-B108B (Revision of JESD22-B108A, January 2003) SEPTEMBER 2010 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION ... 文档格式:PDF | 页数:14 | 浏览次数:651 | 上传日期:2020-...
JEDEC STANDARD Coplanarity Test for Surface-Mount Semiconductor Devices JESD22-B108A (Revision of JESD22-B108) JANUARY 2003 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION 阅读了该文档的用户还阅读了这些文档 214 p. Shep Hyken - I'll Be Back_ How to Get Customers to Come Back Again & Again-Sound ...
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JEDEC JESD22-B108B：2010 Coplanarity Test for Surface-Mount Semiconductor Devices（ 表面贴装半导体器件的共面性测试 ）JEDEC JESD22-B109C：2021 Flip Chip Tensile Pull（倒装芯片拉伸强度）JEDEC JESD22-B110B.01：2019 Mechanical Shock – Device and Subassembly（机械冲击 - 设备和组件）JEDEC JESD22-B111...
JEDEC JESD22-B105E:2018 Lead Integrity(引线完整性) JEDEC JESD22-B106E:2016Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的抗焊接冲击性 ) JEDEC JESD22-B107D:2011 Mark Permanency(标记永久性) JEDEC JESD22-B108B:2010 Coplanarity Test for Surface-Mount Semiconductor Devi...
JEDEC JESD22-B105E:2018 Lead Integrity(引线完整性) JEDEC JESD22-B106E:2016Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的抗焊接冲击性 ) JEDEC JESD22-B107D:2011 Mark Permanency(标记永久性) JEDEC JESD22-B108B:2010 Coplanarity Test for Surface-Mount Semiconductor Devi...
JEDEC JESD22-B106E:2016Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的抗焊接冲击性 ) JEDEC JESD22-B107D:2011 Mark Permanency(标记永久性) JEDEC JESD22-B108B:2010 Coplanarity Test for Surface-Mount Semiconductor Devices( 表面贴装半导体器件的共面性测试 ) ...
JEDEC JESD22-B106E:2016Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的抗焊接冲击性 ) JEDEC JESD22-B107D:2011 Mark Permanency(标记永久性) JEDEC JESD22-B108B:2010 Coplanarity Test for Surface-Mount Semiconductor Devices( 表面贴装半导体器件的共面性测试 ) ...
JESD22-B117A 22 热冲击试验 (TST) JESD22A106-B 据查是晶圆级的考核 23 盐雾试验 JESD22-A107-B 24 耐焊接热试验标准 JESD22-B106-B 25 温湿度敏感器件的符号与标识 JEP113-B 26 表贴半导体器件的共面性试验 JESD22-B108 HTOL:high temperature operating life高温工作寿命试验 2 x) S6 B) M* p;...
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