IPC-A-610国际标准中英文对照
IPC-A-610国际标准中英文对照
solder fillet requirements. 半润湿 半润湿 5.2.6 Soldering Anomalies – Excess Solder 焊料过多 焊料过多 5.2.6.1 Soldering Anomalies – Excess Solder – Solder Balls/Solder Fines Target - Class 1,2,3 • No evidence of solder balls on
课件 5.2.7.1 Soldering Anomalies - Excess Solder- Solder Balls ? Solder balls are spheres of solder that remain after the soldering process. This includes small balls of the original solder paste metal screen size that have splattered around the connection during the reflow process. ? The method...
Solder 1-6 3.3.4 Electronic Assemblies 3-11 1.6.7 Meniscus (Component) 1-6 3.3.5 After Soldering 3-11 1.6.8 *Nonfunctional Land 1-6 3.3.6 Gloves and Finger Cots 3-12 1.6.9 Pin-in-Paste 1-6 1.6.10 Solder Balls 1-6 4 Hardware 4-1 1.6.11 Wire Diameter 1-6 1.6.12 Wire ...
5-焊点质量评定及IPC-A-610C(D)介绍 焊点质量评定及IPC-A-610D介绍 顾霭云
焊点质量评定及IPC-A-610C（D）介绍 顾霭云 无铅焊点的特点 ①浸润性差，扩展性差。②无铅焊点外观粗糙。传统的检验标准与AOI需要升级。③无铅焊点中气孔较多，但气孔不影响机械强度。④缺陷多——由于浸润性差，使自定位效应减弱。•浸润性差，要求助焊剂活性高。浸润性差 应对措施：•改良助焊剂活性•修改...
SMT异常(SMT anomalies)。增加了有关墓碑(tombstoning)、共面性(coplanarity)、锡膏回流(solder paste reflow)、不熔湿(nonwetting)、去湿(dewetting)、紊锡(disturbed solder)、裂锡(ractured solder)、针孔(pinholes)、吹气孔(blowholes)、锡桥(bridging)、锡球(solder balls)和锡带(solder webbing)的...
SMT异常(SMT anomalies)。增加了有关墓碑(tombstoning)、共面性(coplanarity)、锡膏回流(solder paste reflow)、不熔湿(nonwetting)、去湿(dewetting)、紊锡(disturbed solder)、裂锡(ractured solder)、针孔(pinholes)、吹气孔(blowholes)、锡桥(bridging)、锡球(solder balls)和锡带(solder webbing)的...
Solder balls/splashes which are within 0.13 mm of lands or traces, or exceed 0.13 mm in diameter. More than five (5) solder balls/splashes (0.13 mm or less) per 600 mm 2 . 課程編號: 140 Compal/QA/Angel Lee 焊錫(Solder): 允收需求(Acceptability Requirements) ...