IPC-A-610C培训目的 使学员理解最终产品的要求提高辨别技能提升灵活性，响应能力，和最佳制造规程提供便于传递的职业技能 5 对电子产品划分为三个级别：一级---通用类电子产品 包括消费类电子产品，部分计算机及其外围设备，那些对外观要求不高而以其使用功能要求为主的产品 二级---专用服务类电子产品 包括通讯设备，...
气孔:由气体散发造成的空洞或空穴 Blowhole: A void caused by outgassing. 锡尖Solder Projection 锡尖:在凝固的焊点或焊料表面出现的不理想的焊料突出 Solder projection: An undesirable protrusion of solder from a solidified solder joint or coating. 不润湿Nonwetting 不润湿:熔锡局部粘附于表面连接处,其他...
气孔:由气体散发造成的空洞或空穴 Blowhole: A void caused by outgassing. * 精品课件资料 锡尖Solder Projection 锡尖:在凝固的焊点或焊料表面出现的不理想的焊料突出 Solder projection: An undesirable protrusion of solder from a solidified solder joint or coating. * 精品课件资料 不润湿Nonwetting 不润湿:...
No void areas or surface imperfections. Lead and circuitry are well wetted, lead is visible. 100% solder fillet around lead. Solder covers lead and feathers out to a thin edge on land/conductor. 拒收(Nonconforming Defect) (B)填錫輕微击出, 因過多的錫而 ...
Avoid solder masks in cavities. 3. Default surface finish: ENIG In the previous version, the default surface finish was tin/lead. However, most manufacturers prefer ENIG as it can be processed in-house, whereas tin/lead finishes are generally outsourced. ...
film or curtain that is parallel to, but not necessarily adhering to, a surface that should be free of solder.针孔Pinhole 气孔Blowholel针孔:穿透焊点进入内部的小孔 Pinhole: A small hole that penetrates entirely through a layer of material.l气孔:由气体散发造成的空洞或空穴 Blowhole: A void ca ...
Those particular pads have probably heavy ground planes and no relief so they require higher temperatures than the rest to get them soldered/unsoldered However, the root cause of the problem is improper reflow the first time (initial pick and place and reflow) and this is what it needs fixe...
IPC-A-610F通用焊接标准.ppt,The contact angle of the solder connection shown in this image is… Target Acceptable Process Indicator Defect ? b. 参考: 1, 5 Soldering Student Handbook, Certified IPC Trainer, IPC-A-610C For Training Purposes Only—This is No
电子产品组装标准IPC j - std - 001和IPC - a - 610更新 IPC Association Connecting Electronics Industries has released the F revisions of two of the industry s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability...
Failure analysis of (DIMM hole) solder void in lead free process used OSP coated PCB IPC-610D defines the degree of barrel fill in PTH (Planting through hole) into three levels, 25%, 50% and 75%. However, in PCBA stage, when using X-ray to ... MC Liao,T Hai,R Wang - IEEE 被...