Each kit contains a board, HASL finish for tin-lead soldering, and all of the parts required to complete the IPC J-STD-001 Workmanship Recertification for both CIS and CIT students. IPC J-STD 001 - CIS/CIT - Recertification Solder Training Kit (HASL) was added in May 2019 ...
Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册 IPC-...
44、of Facilities That Inspect/Test Printed Boards, Components and Materials印制板, 元件和材料检验/试验企业的授证IPC-9191 General Guidelines for Implementation of Statistical Process Control统计过程控制导则 IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering StudyIPC第3阶段受控气氛焊接研究IPC-MI-...
Soldering Printed 97 Wiring Boards IPC-TR-462 Solderability Evaluation of Printed Boards with Protective 98 Coatings Over Long-term Storage 99 IPC-TR-464 Accelerated Aging for Solderability Evaluations IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control 100 Stability IPC-TR-465-2 The ...
Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例IPC-AJ-820Assembly & Joining Handbook 装联手册IPC-7530Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南IPC-9701Performance Test ...
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results (清洗和洁净度测试程序第1阶段测试结果) 10/89 (orig. pub.) IPC-TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study IPC Phase 3 可控气氛焊接研究) 8/94 (orig. pub.) IPC-TR-582 IPC Phase 3 No-Clean Flux Study (...
ComponentIdentificationTraining&ReferenceGuideDW-426-SpecificationforAssemblyofDiscreteWiringTR-581-IPCPhaseIIIControlledAtmosphereSolderingStudyTA-722-TechnologyAssessmentHandbookonSolderingTA-723-TechnologyAssessmentHandbookonSurfaceMountingCM-770E-ComponentMountingGuidelinesforPrintedBoardsSM-780-ComponentPackagingand...
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards IPC-TA-722 Technology Assessment of Soldering IP...
IPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes,PhaseIIA替代涂覆层的蒸汽老化评价 IPC-TR-466TechnicalReport:WettingBalanceStandardWeightComparisonTest技术报告:润湿天平称重标准对比测试 SMC-WP-001SolderingCapabilityWhitePaperReport可焊性工艺导论 SMC-WP-005PCBSurfaceFinishes印制电路板表面清洗...
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南 IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求 IPC-TP-1090 The Layman’s Guide to Qual...