J-STD-001, Soldering and Process controls Inspection, IPC-A-610 Etc. This include copper plating thickness in the holes, annular ring requirements, multilayer spacing requirements, manufacturing process controls, facilities process controls just to mention a few. This is a complicated process and to...
Soldering defects on a circuit board The amount ofbarrel fill required for through-hole leads is 50% for class 2 and 75% for class 3. As it can be delicate to get the paste into small plated through-holes (PTH), Sierra’s advice is to design your PTH15 milover the diameter of the ...
Its acceptance standard is IPC-A-610 Class 2. Though it is a consumer electronic assembly, it has a flexible sensor PCB module, and its SMT soldering is fine-pitch, making the electronic assembly quite advanced. IPC-A-610 Class 3 The most rigorous standard among the IPC classes is Class ...
1.Continually improve our quality, efficiency, service to satisfy thecustomer's requirement. Quality Specifications: Quality System: 1. ISO-9001:2018 Quality System Standard 2. Quality Standard: IPC-610-D class 2, 3. Soldering Standard: J-STD-0...
Soldering Visual Inspection An International Leader in Solder Training and IPC Certification EPTAC has been helping corporations increase quality standards, improve productivity, and maximize profits for over 30 years. With nineteen (19) locations in North America, online courses and webinars, and on-...
IPC-A-610 specifies criteria for solder joint acceptability, covering aspects like the shape, size, and overall workmanship of the solder connections. This includes criteria for through-hole soldering, surface mount technology (SMT) soldering, and mixed-technology assemblies. The standard defi...
For the first time, IPC hosted a regional hand soldering competition in Vincenza, Italy, at Focus on PCB May 17-18. Welcoming 28 competitors representing 20 Italian companies, contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria and...
Figure 3. IPC-A-610D, 8-51, Soldering on a Melf. When defect features occur in combination -- e.g. insufficient solder on a displaced component -- a defect state can be present even though the individual features are within tolerances. This compounded defect can be detected by human visu...
Historically the reason for this difference is that the ceramic or glass-bodied parts have glass seals that may be damaged by the mechanical forces and/or thermal shock of direct contact with molten solder. In wave or hand soldering applications, this is certainly a concern, but in reflow, le...
Url: https://www.eptac.com/class/ipc-7711-7721-standard-expert More training courses from EPTAC Corporation » EPTAC Hand Soldering Re-Certification | MN EPTAC Hand Soldering Re-Certification | CT EPTAC Hand Soldering Re-Certification | IL EPTAC Hand Soldering Re-Certification | CA IPC J-STD...