IPC 4761 Via孔保护 01 1. Type I-a:在via孔的单面盖阻焊干膜,不允许额外的材料入孔。 Type I-b:在via孔的双面盖阻焊干膜,不允许额外的材料入孔。 02 2. Type II-a:在Type I-a的基础上,干膜上盖阻焊。 Type II-b:在Type I-b的基础上,干膜上盖阻焊。 03 3.Type III-a:via孔单面塞孔,via...
IPC-4761 via typeType Cat Description figure process Remark I I-a Tented Via Tented Via (Type I Via): A via with a dry film mask material applied bridging over the via wherein no additional materials are in the hole. It may be applied to one side (Type I-a) or both sides (Type ...
TypeCatDescriptionfigureprocessRemarkII-aTentedViaTentedVia(TypeIVia):Aviawithadryfilmmaskmaterialappliedbridgingovertheviawhereinnoadditionalmaterials..
Filled, Plugged, Plated Via‐In‐Pad, and … IPC 4761 John Steinar Johnsen,‐ Josse‐, November 2010 Increasing use of High Density Interconnect Printed Circuit Boards (HDI PCBs), the plugging of microvias has become an inevitable subject for many manufacturers of PCBs. And it is as always ...
Eagle Electronics is now offering 3 day turns, for qualified prototype orders, which require via fill per IPC-4761 type VII. The demand for quick turn via-in-pad technology has grown exponentially over the past several years and Eagle Electronics is providi...
Plate and fill vias in the cavity as per IPC-4761 Type VII. Avoid solder masks in cavities. 3. Default surface finish: ENIG In the previous version, the default surface finish was tin/lead. However, most manufacturers prefer ENIG as it can be processed in-house, whereas tin/lead finishes...
浅谈IPC 4761 Via孔保护 描述 IPC 4761 Via孔保护 01 1. Type I-a:在via孔的单面盖阻焊干膜,不允许额外的材料入孔。 Type I-b:在via孔的双面盖阻焊干膜,不允许额外的材料入孔。 02 2. Type II-a:在Type I-a的基础上,干膜上盖阻焊。 Type II-b:在Type I-b的基础上,干膜上盖阻焊。
IPC-4761 via typeType Cat Description figure process Remark I I-a Tented Via Tented Via (Type I Via): A via with a dry film mask material applied bridging over the via wherein no additional materials are in the hole. It may be applied to one side (Type I-a) or both sides (Type ...
IPC-4761viatype IPC-4761viatype
IPC-4761 Plugged via阻焊塞孔标准 8