IPC-4552 Speci®cation for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards IPC-4552 October 2002 A standard developed by IPC 2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax Warning : . The Principles of In May 1995 the IPC's Technical Activities ...
IPC-4552B-2021 EN印制板化学镀镍 浸金(ENIG)镀覆性能规范 英文版.pdf,IPC-4552B 2021 - April Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards Supersedes IPC-4552A August 2017 An international standard developed by IPC The
IPC-4552July2002SpecificationforElectrolessNickel/ImmersionGold(ENIG)mittee(4-14)InterimFinalProposedbyIPC2215SandersRoad,Northbrook,IL60062Phone:(847)509-9700Fax:(847)509-9798URL:-4552SpecificationforElectrolessNickel/ImmersionGold(ENIG)PlatingforPrinte
1、ipc-4552印刷电路板化镍沉金电镀规范印刷电路板化镍沉金电镀规范1.范围1.1范围 本规范规定了印刷电路板使用化镍沉金的表面加工方式的要求,本规范确定了基于性能标准的化镍沉金沉积厚度的要求,它适用于供应商,印制电路厂商,电子制造业服务商和原设备厂商。1.2 描述 化镍沉金是指化学腐蚀一层镍,再在镍层上面沉积...
Printed Boards IPC-CH-65B 印制电路板和组件的清洗指南 Guidelines for Cleaning of Printed Boards and Assemblies IPC-9252A 未组装印制板电气测试要求 Requirements for Electrical Testing of Unpopulated Printed Boards IPC-9121 印制板制造工艺问题解答 Troubleshooting for PCB Fabrication Processes IPC-4552A 印...
印制板用处理“E”玻璃纤维布 Specification for Finished Fabric Woven 2001 English 39 IPC-4412B B 规范 from E Glass for Printed Boards B 中文 Specifiaction for Electroless 印制板化学镍/浸金(ENIG)镀 40 IPC-4552 Nickel/Immersion Gold (ENIG)Plating for 2012.12 2002 English 层规范 Printed Circuit...
4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍 /沉金规范 IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则 IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias 印制板通孔机加工方案的改进和优选...
(OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as ...
IPC标准(6)序号 项目 摘自 1孔径公差IPC-6012B 常用的IPC标准 页码 第2页 IPC标准 元件孔+/-0.10mm过线孔+0.08mm(负公差无要求可以全部或部分塞孔)NPTH:+/-0.08mm 孔径公差.pdf 2介质层厚度IPC-6012B 第2页 最小90um=0.09mm 铜箔厚度 标准的厚度 第7页 HOZ 17.1um 3 来料铜箔厚度 IPC-4101A...
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