《IEEE Transactions on Components Packaging and Manufacturing Technology》的影响因子近年稳定上升,2022年影响因子为2.2分。 3.分区 《IEEE Transactions on Components Packaging and Manufacturing Technology》在中科院升级版中,大类工程技术位于3区,小类工程:制造位于4区,工程:电子与电气、材料科学:综合位于3区,非综述...
IEEE Transactions on Emerging Topics in Computing 5.1 IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS 5.1 IEEE TRANSACTIONS ON RELIABILITY 5 IEEE Transactions on Cognitive and Developmental Systems 5 IEEE TRANSACTIONS ON ENERGY CONVERSION 5 IEEE Open Journal of Power Electronics 5 IEEE TRANSACTIONS O...
影响因子(2023) 1.389IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive...
IEEE Transactions on Components Packaging and Manufacturing Technology期刊影响因子数据,中科院JCR分区与学科排名数据,CiteScore学科排名数据,期刊的基础信息参数与简介,以综合的数据为投稿者提供参考。
《元件封装与制造技术IEEE Transactions》(Ieee Transactions On Components Packaging And Manufacturing Technology)是一本以ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC综合研究为特色的国际期刊。该刊由Institute of Electrical and Electronics Engineers Inc.出版商创刊于2011年,刊期12 issues/year。该刊...
所有SCI期刊影响因子 链接:https://pan.baidu.com/s/1tvbxqQnEXMSrSwfx4N-rTQ提取码: e19n 复制这段内容后打开百度网盘手机App,操作更方便哦 以下为IEEE系列 IEEE Communications Surveys and Tutorials 35.6 IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE 23.6 ...
《Ieee Transactions On Components Packaging And Manufacturing Technology》(《元件封装与制造技术IEEE Transactions》)是一本由Institute of Electrical and Electronics Engineers Inc.出版的ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC学术刊物,主要刊载ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ...
影响指数:5.858 期刊ISSN:0090-6778年文章数:409国人占比:0.23 自引率:9.40%版面费:US$2195审稿周期:Monthly是否OA:否 JCR分区:Q1中科院分区:Q1出版国家/地区:UNITED STATES是否预警:不在预警名单内 相关指数 影响因子 影响因子 年发文量 自引率 Cite Score ...
影响因子:2.3 是否预警:否 语言:English 是否OA开放访问:未开放 研究方向:ENGINEERING, MANUFACTURING - ENGINEERING, ELECTRICAL & ELECTRONIC 杂志简介 SCIE期刊 学科领域:ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application ...
期刊名称 IEEE Transactions on CommunicationsIEEE T COMMUN 期刊ISSN 1558-0857 期刊官方网站 https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=26 是否OA No 出版商 Institute of Electrical and Electronics Engineers Inc. 出版周期 Monthly 文章处理费 登录后查看 始发年份 年文章数 502 影响因子...