IEEE Transactions on Emerging Topics in Computing 5.1 IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS 5.1 IEEE TRANSACTIONS ON RELIABILITY 5 IEEE Transactions on Cognitive and Developmental Systems 5 IEEE TRANSACTIONS ON ENERGY CONVERSION 5 IEEE Open Journal of Power Electronics 5 IEEE TRANSACTIONS O...
IEEE Transactions on Components Packaging and Manufacturing Technology期刊影响因子数据,中科院JCR分区与学科排名数据,CiteScore学科排名数据,期刊的基础信息参数与简介,以综合的数据为投稿者提供参考。
IEEE Transactions on Components Packaging and Manufacturing Technology期刊的研究范围包括以下内容:电子元器件设计和制造、封装制造技术、可靠性和可持续性、新兴技术和应用。 5.稿件类型 IEEE Transactions on Components, Packaging, and Manufacturing Technology接受以下类型的稿件:原创研究论文、 综述文章、通信、专题文章...
影响因子:指该期刊近两年文献的平均被引用率,即该期刊前两年论文在评价当年每篇论文被引用的平均次数 Created with Highcharts 10.0.0年份IEEE Transactions on Components Packagingand Manufacturing Technology近年影响因子IEEE Transactions on Components Packaging and ManufacturingTechnology近年影响因子20142015201620172...
《元件封装与制造技术IEEE Transactions》(Ieee Transactions On Components Packaging And Manufacturing Technology)是一本以ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC综合研究为特色的国际期刊。该刊由Institute of Electrical and Electronics Engineers Inc.出版商创刊于2011年,刊期12 issues/year。该刊...
IEEE TRANSACTIONS ON IMAGE PROCESSING 10.6 IEEE TRANSACTIONS ON MEDICAL IMAGING 10.6 IEEE Transactions on Neural Networks and Learning Systems 10.4 IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS 10.4 IEEE Transactions on Smart Grid 9.6 IEEE NETWORK 9.3 ...
影响因子(2023)1.393 IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive...
影响因子:2.3 是否预警:否 语言:English 是否OA开放访问:未开放 研究方向:ENGINEERING, MANUFACTURING - ENGINEERING, ELECTRICAL & ELECTRONIC 杂志简介 SCIE期刊 学科领域:ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application ...
《Ieee Transactions On Components Packaging And Manufacturing Technology》(《元件封装与制造技术IEEE Transactions》)是一本由Institute of Electrical and Electronics Engineers Inc.出版的ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC学术刊物,主要刊载ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ...
IF影响因子 自引率15.40% 主要研究方向工程技术-ENGINEERING, ELECTRICAL & ELECTRONIC工程:电子与电气;MATERIALS SCIENCE, MULTIDISCIPLINARY材料科学:综合;ENGINEERING, MANUFACTURING工程:制造 Transactions on Components, Packaging and Manufacturing Technology《IEEE器件封装与制造技术汇刊》(月刊). IEEE Transactions on Com...