影响因子(2023)1.390 IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive...
IEEE Transactions on Components Packaging and Manufacturing Technology期刊的研究范围包括以下内容:电子元器件设计和制造、封装制造技术、可靠性和可持续性、新兴技术和应用。 5.稿件类型 IEEE Transactions on Components, Packaging, and Manufacturing Technology接受以下类型的稿件:原创研究论文、 综述文章、通信、专题文章...
IEEE Transactions on Emerging Topics in Computing 5.1 IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS 5.1 IEEE TRANSACTIONS ON RELIABILITY 5 IEEE Transactions on Cognitive and Developmental Systems 5 IEEE TRANSACTIONS ON ENERGY CONVERSION 5 IEEE Open Journal of Power Electronics 5 IEEE TRANSACTIONS O...
IEEE Transactions on Components Packaging and Manufacturing Technology期刊影响因子数据,中科院JCR分区与学科排名数据,CiteScore学科排名数据,期刊的基础信息参数与简介,以综合的数据为投稿者提供参考。
所有SCI期刊影响因子 链接:https://pan.baidu.com/s/1tvbxqQnEXMSrSwfx4N-rTQ提取码: e19n 复制这段内容后打开百度网盘手机App,操作更方便哦 以下为IEEE系列 IEEE Communications Surveys and Tutorials 35.6 IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE 23.6 ...
《Ieee Transactions On Components Packaging And Manufacturing Technology》(《元件封装与制造技术IEEE Transactions》)是一本由Institute of Electrical and Electronics Engineers Inc.出版的ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC学术刊物,主要刊载ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ...
影响指数:5.858 期刊ISSN:0090-6778年文章数:409国人占比:0.23 自引率:9.40%版面费:US$2195审稿周期:Monthly是否OA:否 JCR分区:Q1中科院分区:Q1出版国家/地区:UNITED STATES是否预警:不在预警名单内 相关指数 影响因子 影响因子 年发文量 自引率 Cite Score ...
期刊名称 IEEE Transactions on CommunicationsIEEE T COMMUN 期刊ISSN 1558-0857 期刊官方网站 https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=26 是否OA No 出版商 Institute of Electrical and Electronics Engineers Inc. 出版周期 Monthly 文章处理费 登录后查看 始发年份 年文章数 502 影响因子...
影响因子:2.3 是否预警:否 语言:English 是否OA开放访问:未开放 研究方向:ENGINEERING, MANUFACTURING - ENGINEERING, ELECTRICAL & ELECTRONIC 杂志简介 SCIE期刊 学科领域:ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application ...
影响因子高的计算机视觉SCI《IEEE Transactions on Pattern Analysis and Machine Intelligence》晨晨SCI论文 立即播放 打开App,流畅又高清100+个相关视频 更多52 -- 0:13 App 经典期刊,医学影像SCI《IEEE Transactions on Medical Imaging》 747 -- 0:13 App 水刊之王SCI——总环 60 -- 0:13 App IEEE计算机...