3D 层叠式同步动态随机存取存储器（3D-Stacked DRAM）HBM技术中，3D-stacked DRAM是一项关键步骤。通过在硅晶圆上铺设多层DRAM芯片并使用硅通孔(TSV)进行垂直电气连接，实现堆叠层间的连接。这种三维堆叠不仅节省空间，而且显著提升了数据传输速率和带宽，对于高性能计算环境中的实时数据处理具有重要意义。三维堆叠内存架构...
3D 层叠式同步动态随机存取存储器(3D-Stacked DRAM) HBM技术中,3D-stacked DRAM是一项关键步骤。通过在硅晶圆上铺设多层DRAM芯片并使用硅通孔(TSV)进行垂直电气连接,实现堆叠层间的连接。这种三维堆叠不仅节省空间,而且显著提升了数据传输速率和带宽,对于高性能计算环境中的实时数据处理具有重要意义。 三维堆叠内存架构 ...
Hynix的首席工程师Minsuk Suh也确认了3D堆叠式内存的两种应用场景:主内存应用的3D stacked memory和针对网络及图形应用的3D stacked HBM。 HBM的首批应用预计将集中在GPU上,这是因为GPU对高速内存的需求最为迫切,尤其是在处理复杂的图形渲染和大规模并行计算时。之后,HBM技术将进一步扩展到网络和高性能计算(HPC)领域...
3D-Stacked DRAM:直接描述了HBM的3D堆叠技术特点。 解释:This expression directly describes the 3D stacking technology feature of HBM, which is its core advantage. Ultra-Wideband Memory:虽然“Ultra-Wideband”常用于通信领域,但在这里可以类比强调HBM的极宽带宽特性。 解释:Although 'Ultra-Wideband' is commonl...
The industry has finally begun to move beyond eight layers per stack for what is currently the fastest 3D-stacked memory available. ByJosh NoremFebruary 27, 2024 Share on Facebook (opens in a new window) Share on X (opens in a new window) ...
3D-Stacked Memory Architectures The 3D-stacked memory architectures represent a leap in memory design, combining several layers of integrated circuits (ICs) into a single package. By stacking memory dies, HBM effectively minimizes the signal distance and presents vast improvements in latency and energy...
Hynix首席工程师Minsuk Suh证实,他们的3D堆叠式内存将产品,将同时有面向主内存应用的3D stacked memory、以及面向网络和图形应用的3D stacked HBM。 Suh表示,首个HBM应用将部署到GPU上,随后则是网络和HPC应用。与标准的DDR4内存相比,HBM堆栈的功耗要少30%,而尺寸也减少了37X。
3D stacked memory solutions featuring Xperi’s DBI Ultra technology. (Source: Xperi) “If I look at the [upcoming HBM4 specification] and the 2048-bit wide interface, that brings the pin count to ~5500 pins, which is in the same league as most server CPUs...
1. What is high bandwidth memory used for? HBM stands for high bandwidth memory and is a type of memory interface used in 3D-stacked DRAM (dynamic random access memory) in some AMD GPUs (aka graphics cards), as well as the server, high-performance computing (HPC), and networking and cl...
when we announced our first 8.4Gbps HBM3E PHY supporting >1TB/s of memory bandwidth per HBM DRAM. Customers building advanced AI processors have used this speed while building margin into their systems. Recall that HBM3E is a 3D stacked DRAM with 1024-bit wide data (16 64-bit channels). ...