A D-stacked memory device including: a base die including a plurality of switches to direct data flow and a plurality of arithmetic logic units (ALUs) to compute data; a plurality of memory dies stacked on the base die; and an interface to transfer signals to control the base die.Mu-...
While Processing-in-Memory has been investigated for decades, it has not been embraced commercially. A number of emerging technologies have renewed interest in this topic. In particular, the emergence of 3D stacking and the imminent release of Micron's Hybrid Memory Cube device have made it more...
despite impressiveprogressat the conference, it’s not good enough tokeepup with AI. For memory a big focus was compute-in-memory, a potential longer-term solution for the
A method includes reading, at a memory controller, data from a first dynamic random-access memory (DRAM) die layer of a DRAM stack. The method also includes writing the data to a second DRAM die layer of the DRAM stack. The method further includes sending a request to a test engine to...
At GTC 2014, NVIDIA announced their next-generation high-performance Pascal GPU which will feature new innovations in addition to the high performance graphics core.
13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Agilex™ 7 FPGAs and SoCs M-SeriesAgilex™ 7 FPGAs and SoCs M-Series offer options for integrated HBM2E DRAM memory. The HBM2E memory blocks are inside the package together with the high-performance FPGA core fabric, transceive...
3D-Stacked Memory Architectures for Multi-core Processors Three-dimensional integration enables stacking memory directly on top of a microprocessor, thereby significantly reducing wire delay between the two. Previ... GH Loh - 《Acm Sigarch Computer Architecture News》 被引量: 854发表: 2008年 In ...
K. Lim, "3d-maps: 3d massively parallel processor with stacked memory," in Solid-State Circuits Confer- ence Digest of Technical Papers (ISSCC), 2012 IEEE International, feb. 2012, pp. 188 -190.S. K. Lim, 3d-maps: 3d massively parallel processor with stacked memory, in: Design for ...
SK Hynix readying for 3D stacked memory commercialization: a closer look 来自 i-micronews.com 喜欢 0 阅读量: 4 作者: Y Développement 收藏 引用 批量引用 报错 分享 全部来源 求助全文 i-micronews.com 相似文献Next Step For Green Aviation: 'Bioports' - Forbes conventional biofuels industry, ...
This paper presents a new patterning scheme that allows self-alignment of active area contacts at different z-elevations. This patterning approach can be used for various types of 3D logic and memory devices. From an incoming structure using a stack of materials with different etch selectivity, ...