A D-stacked memory device including: a base die including a plurality of switches to direct data flow and a plurality of arithmetic logic units (ALUs) to compute data; a plurality of memory dies stacked on the base die; and an interface to transfer signals to control the base die.Mu-...
展开 关键词: CMOS integrated circuits SRAM chips digital signal processing chips system-on-chip three-dimensional integrated circuits 3D IC design 3D stacked memory system architecture exploration 3D stacking interface 3D-DSP SoC system ESL virtual platform 会议时间: 4-9 May 2014 被...
A method includes reading, at a memory controller, data from a first dynamic random-access memory (DRAM) die layer of a DRAM stack. The method also includes writing the data to a second DRAM die layer of the DRAM stack. The method further includes sending a request to a test engine to...
DRAM存算（存内计算和近存计算）的过往，相关技术包括：Processing-In-Memory存内计算，智能DIMM，HMC、HBM、3D-Stacked DRAM与逻辑。Processing-In-Memory存内计算。有两种方式，一种是存储颗粒里面，采用DRAM器件在存储阵列旁边构建一个逻辑电路，早在1992年多伦多大学就提出了Computational RAM，加速了卷积和Data Minin...
DRAM存算(存内计算和近存计算)的过往,相关技术包括:Processing-In-Memory存内计算,智能DIMM,HMC、HBM、3D-Stacked DRAM与逻辑。 Processing-In-Memory存内计算。有两种方式,一种是存储颗粒里面,采用DRAM器件在存储阵列旁边构建一个逻辑电路,早在1992年多伦多大学就提出了Computational RAM,加速了卷积和Data Mining等应...
2012年2月,美国佐治亚理工学院、韩国KAIST大学和Amkor Technology公司在“ISSCC 2012”上,共同发布了将277 MHz驱动的64核处理器芯片以及容量为256 KB的SRAM芯片三维层叠后构筑而成的处理器子系统“3D-MAPS:3D Massively Parallel Processor with Stacked Memory”。
3D stacked memory has significant advantages in terms of high bandwidth, high density, low latency, low power consumption and etc. In 3D architecture, the reliability of each memory layer varies with respect to its working environment. Previous studies have introduced various ways to improve the re...
接下来另一项关键技术则是3D Memory显存封装技术,其实在之前下代架构还是叫Volte的时候就有介绍过,这项技术是通过堆叠闪存(Stacked DRAM)并使用硅通孔(TSV)相连接,获得更大的带宽、容量以及更好的能耗,而且还会封装在GPU SoC上,大家可以在样卡上发现这一点。
3D-Stacked Memory Architectures for Multi-core Processors In this work, we explore more aggressive 3D DRAM organizations that make better use of the additional die-to-die bandwidth provided by 3D stacking, as ... GH Loh - 《Acm Sigarch Computer Architecture News》 被引量: 854发表: 2008年 ...
13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Agilex™ 7 FPGAs and SoCs M-SeriesAgilex™ 7 FPGAs and SoCs M-Series offer options for integrated HBM2E DRAM memory. The HBM2E memory blocks are inside the package together with the high-performance FPGA core fabric, transceive...