FS13MR12W2M1HP_B111200 V CoolSiC™ MOSFET SixPACK三相桥模块 这是一款1200 V,13 mΩEasyPACK™ 2BCoolSiC™ MOSFETSixPACK三桥桥模块,采用增强型第一代CoolSiC™ MOSFET、集成式NTC温度传感器和PressFIT压接技术。 特征描述 出色封装,高度达12 mm ...
But I believe, the FS13MR12W2M1HP_B11 consists of 6 single dies connected in a three-phase inverter configuration. There are no dies connected in parallel. Am I correct? But even if a few dies are connected in parallel and then only one die takes the whole avalanche, why cannot you ...
当然,雪崩还取决于应用条件。 但我相信,FS13MR12W2M1HP_B11 由 6 个单芯片以三相逆变器配置连接而成。 没有并联连接的模具。 我说得对吗? 但是,即使将几个芯片并联连接,然后只有一个芯片承受整个雪崩,为什么不能提供有关单个芯片雪崩等级的信息? 再次感谢你, 德米特里 Like 回复 30 次查看 0 Translation...
But I believe, the FS13MR12W2M1HP_B11 consists of 6 single dies connected in a three-phase inverter configuration. There are no dies connected in parallel. Am I correct? But even if a few dies are connected in parallel and then only one die takes the whole avalanche, why cannot you ...