An LED flip-chip structure is provided, wherein a silica gel, a fluorescent glue, a lens, an anti-reflection film and a packaging adhesive layer is sequentially arranged on the LED chip. The silica gel and fluorescent glue are sequentially filled within an insulating reflective cup, outside ...
3 倒装芯片(Flip chip)工艺 倒装芯片封装技术一般是采用平面工艺在集成电路芯片的输入/输出端(I/O)端制作无铅焊点,将芯片上的焊点与基板上的焊盘进行对位,贴装,然后使用焊料回流工艺在芯片和基板焊盘间形成焊球,再在芯片和基板焊盘间形成焊球,再在芯片与基板间的空隙中填充底部填充胶,最终实现芯片与基板间的电,热...
The invention discloses a flip-chip LED chip structure and a manufacturing method thereof. The LED chip comprises an epitaxial layer taking sapphire as substrate and an electrode layer taking SiO2/Si as substrate; holes of periodical structure are etched on the front surface of the sapphire substr...
Recently, Canada-based VueReal has announced that it has made a breakthrough in the research of flipchip microLED structure. High yield rate and low cost can be achieved, and its yield rate can surpass 99.9%. Currently, the yield rate of most flipchip microLED structures in the market is ...
Recently, Canada-based VueReal has announced that it has made a breakthrough in the research of flipchip microLED structure. High yield rate and low cost can be achieved, and its yield rate can surpass 99.9%. Currently, the yield rate of most flipchip microLED structures in the market is ...
A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder...
Flip-chip light emitting diode package structure A flip-chip LED package structure is disclosed. The flip-chip LED package structure includes a submount, patterned conductive films, a LED chip and two bumps. Several grooves are formed on the sidewalls of the submount. The patterned con... SC...
The Si substrate (1) contains, on one surface, evenly spaced conductors (11), between which is fitted a current interrupting zone (12). At least one chip (2) has on the same surface a plus (21) and a minus terminal (22). They are so fitted, as flip-chip, on the substrate that...
2) flip chip structure 倒装结构 1. By analyzing theflip chip structureof high power InGaN blue +YAG fluorescence powders white light emitting diode(LED),it shows that it can improve the luminous and heat dissipation efficacy. 分析了半导体照明高功率白光LED灯串采用InGaN(蓝)/YAG荧光粉将芯片倒装结...
flip-chip bonding structure and method for making the sameng structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of L Joo-Hoon 被引量: 3发表: 2002年 Flip-chip LED chip structure and manufacturing method thereof The invention discloses a flip-chip LED...