引线框架上倒装芯片(Flip chip on leadframe),又名FCQFN。 FCQFN的尺寸较小,可以用于mems package。其trace比普通的QFN短,高频衰减较小,能让信号快速上升,可以提供更好的电气性能。还可以在lead上贴被动元件,比如电源模块。 内部示意图 结构示意图 Features • FCOL package outline sizes of 1.63 x 1.60 x 0...
FCOL封装，也称为Flip Chip-On-Lead frame，是一种小型化的倒装芯片技术，特别适用于mems package。其优势在于较短的trace设计，能有效降低高频信号的衰减，提高信号传输速度，从而增强电气性能。此外，它允许在引线部分添加被动元件，如电源模块，以实现更全面的功能集成。FCOL的特点包括1.63x1.60x0.58m...
FCOL(FlipChip on Lead Frame)技术介绍 我司采用FCOL(FlipChip on leadframe,金属框架上的倒装芯片封装)封装技术,为客户提供超小型,低成本,大电流,低电阻可靠的封装解决方案。 将普通芯片在晶圆状态时的压点位置重新排列,然后在新压点位置上形成顶端有焊锡的铜柱,铜柱可根据需要长在芯片表面的任何位置。同时工程师...
我司采用FCOL(FlipChip on leadframe,金属框架上的倒装芯片封装)封装技术,为客户提供超小型,低成本,大电流,低电阻可靠的封装解决方案。 将普通芯片在晶圆状态时的压点位置重新排列,然后在新压点位置上形成顶端有焊锡的铜柱,铜柱可根据需要长在芯片表面的任何位置。同时工程师根据芯片的铜柱位置设计匹配的引线框架。将...
There is disclosed a flip-chip-type method of assembling semiconductor devices. A one-step encapsulation process promotes adhesion of the die to the lead fingers and prevents the potential of shorts developing between the adjacent bumps or lead fingers. Conventional mold compound is used to reduce ...
The gap between the chip and the lead frame is thus consistent. This allows encapsulating mould compound to flow easily in the gap, so that the encapsulation is a one step process. Stress caused by coefficient of thermal expansion (CTE) mismatch is reduced.LILY * KHOR...
There is disclosed a flip-chip-type method of assembling semiconductor devices. A one-step encapsulation process promotes adhesion of the die to the lead fingers and prevents the potential of shorts developing between the adjacent bumps or lead fingers. Conventional mold compound is used to reduce ...
Flip chip-in-leadframe package and processA method for connecting a chip to a leadframe includes forming bumps on a die by a Au stud-bumping technique, and attaching the chip to the leadframe by thermo-compression of the bumps onto bonding fingers of the leadframe. Also a flip chip-in-...
Flip chip on lead frame 专利名称：Flip chip on lead frame 发明人：Lily Khor,Au Keng Yeun 申请号：US10638973 申请日：20030811 公开号：US06953711B2 公开日：20051011 专利内容由知识产权出版社提供 专利附图：摘要：There is disclosed a flip-chip-type method of assembling semiconductor devices. A one...
Flip Chip技术不是什么新技术,在上个世纪60年代由IBM研发出来,至于为什么会出现这种技术要从封装的历史说起,这里简单介绍下,传统的封装技术是将芯片(die)放置在引脚(lead frame)上,然后用金线将die上的pad和lead frame连接起来,这一步叫wire bond,但是这种技术封装出来的芯片面积会很大,已经不满足越来越小的智能设...