A flip-chip substrate for bonding with a chip is provided. The chip has an active surface with a plurality of bonding pads and each bonding pad has a bump thereon. The flip-chip substrate has a plurality of contact pads that correspond in positions with the bonding pads on the chip such...
Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding While extensive research on the lead-free solder has been conducted, the high melting temperature of the lead-free solder has detrimental effects on the pa...
摘要: PURPOSE: To bond a flip chip to a substrate by grounding a bump of a flip chip on an electrode of a substrate and a hot pressure bonding piece on a nozzle, by bonding the bump to the electrode and by lifting the nozzle and the hot pressure bonding piece....
A Study on Bonding Pattern Error Detecting of Flip-chip Solder Bump using the Intensity Distribution Map of X-ray Image A new method and package is provided for the mounting of semiconductor devices that have been provided with small-pitch Input/Output interconnect bumps. Fine pitch solder bumps...