ACCµRA™Plus: Production Flip Chip / Die Bonder for Optoelectronic and Silicon photonics applications The SET ACCµRA™Plusis aflip-chip / Die bonderdesigned for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCµRA™Pluscombine...
Replisaurus Technologies的全资子公司SET(Smart Equipment Technology)宣布,其高精度和高效力的键合系统Device Bonder FC300已经收获来自SEMATECH的订单。SEMATECH是由半导体制造商组成的全球性联盟。该订单在今年早期签订,设备将于2009年底发送到SEMATECH位于纽约奥尔
9, 2019 — The NEO HB automatic flip-chip bonder from Smart Equipment Technology Corp. SA is designed for ± 1-µm, 3-σ post-bonding accuracy in standalone or full automatic mode. The system is suitable for direct hybrid bonding processes. The first of a new line dedicated entirely ...
FC150 PLATINUM Versatile Flip Chip Bonder The high degree of flexibility offered on the FC150 PLATINUM makes it the machine of choice for advanced R&D and pilot line. With ± 0.5 µm placement accuracy and 0.7 µm post-bond accuracy, the SET FC150 PLATINUM Flip Chip / Die Bonder serves...
set - smart equipment technology - based in france, is a world leading supplier of high accuracy flip-chip bonders. founded in 1975, set has pioneered in the development of flip chip bonders for infrared sensors and optoelectronics applications. with more than 350 systems installed worldwide, ...
Industry:electronic production Info: set, smart equipment technology, is a world leading supplier of high accuracy die bonders/flip chip bonders and versatile nanoimprint lithography (nil) solutions. we accompany laboratories and industries of semiconductor, which look for a high precision and an impo...
Find out all of the information about the SET product: die-attach die bonder ACCμRA M . Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.
Since 1975, SET has offered flexible Flip-Chip Bonders that can align and bond components with submicron post-bond accuracy.
The NEO HB automatic flip-chip bonder from Smart Equipment Technology Corp. SA is designed for ± 1-µm, 3-σ post-bonding accuracy in
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The FC300 platform performs multiple applications including: ...