gray tone lithographyToday's technologies available for the fabrication of micro structured optical elements are well developed for defined classes of structures. Techniques for very complex optical functions or for combinations of optical functions together with others are more or less in the level of...
Hybrid lithography, by contrast, is the use of different lithography technologies on a single resist level which enables the marriage of both technology's best properties. In this work, we present hybrid e-beam direct write and optical lithography, enabling high throughput (optical), high-...
E-beam lithography
Combined e-beam and optical exposure lithography for semiconductor fabrication is disclosed. E-beam direct writing to is employed to create critical dimension (CD) areas of a semiconductor design on a semiconductor wafer. Optical exposure lithography is employed to create non-CD areas of the ...
E-Beam Lithography Optical Lithography Optical Lithography Resolution controlled by λ and z Mask issues: 1x, damage Resolution affected by λ, NA Mask 4x, protected Gap (z) Contact Objective Lens Source Mask Substrate Proximity Projection
Q:MacEtch技术在刻蚀Si和GaN 的纳米结构的应用上, 能达到的最小的横向分辨率分别是多少? A:我们可以用光刻(optical lithography),电子束光刻(EBL,e-beam lithography)甚至可以用扫描透射电子显微术(STEM, scanning transmission electron microscope)来沉积单个原子或者原子线图形,我们也在探索,我们最小能做到什么尺寸。
Recently, ASML/HMI introduced their first jointly developed system. It combines HMI’s e-beam tool with ASML’s computational lithography engine. With the computational engine, ASML is able to model and simulate the reticle features and how they would translate on the wafer. “If you do that,...
Alignment Strategy for Mixed E-Beam and Optical Lithography 机译:混合电子束和光学光刻的对准策略 获取原文 获取原文并翻译 | 示例 获取外文期刊封面目录资料页面导航 摘要 著录项 相似文献 相关主题 摘要 Although maskless electron beam lithography is viewed as an alternative lithographic techn...
Combined e-beam and optical exposure lithography for semiconductor fabrication is disclosed. E-beam direct writing to is employed to create critical dimension (CD) area
Hybrid lithography optimization with E-Beam and immersion processes for 16nm 1D gridded design Since some of major IC industry participants are moving to the highly regular 1D gridded designs to enable scaling to sub-20nm nodes, how to manufacture th... Y Du,H Zhang,MDF Wong,... - Design...