Slurry distribution system for a CMP process in semiconductor device fabricationA slurry distribution system for supplying slurry used in the planarization process of a wafer surface by chemical reaction is provided with a movable supply line having an open end which is maintained at a constant depth...
Chemical mechanical processing (CMP)is a process that ensures regions of semiconductor components are level, or planarized. The final word of its name can vary, and the process can be described as planarization or polishing, among others. Precursors to this technology were developed in the 1950s...
CMP processes in semiconductor front-end, back-end, packaging and so on. *Examples of polishing materials: Silicon-based materials (poly-Si, SiO2, SiN), metals, resin Features Design and manufacturing of abrasive particles Accumulated technology of polishing materials for glasses Design and manufactur...
The present invention generally relates to the formation of a micro-electromechanical system (MEMS) cantilever switch in a complementary metal oxide semiconductor (CMOS) back end of the line (BEOL) process. The cantilever switch is formed in electrical communication with a lower electrode in the ...
Run-to-run (R2R) control is widely used in semiconductor manufacturing systems to minimize the process drift, shift and variability. The R2R controller adj... SZX Liu - 《Isa Transactions》 被引量: 0发表: 2018年 A survey of run-to-run control for batch processes. Run-to-run (R2R) ...
CMP阻挡层浆料系统半导体Introduction The process development of copper/low-K backends is unique in the semiconductor industry. Thereare a substantial number of... ChristineYe MichaelOliver - 《半导体技术》 被引量: 0发表: 2003年 CMP用浆料,抛光方法和半导体器件的制造方法 本发明涉及CMP用浆料,抛光方法...
而化学机械平坦化(CMP)技术是当今半导体制造中形成浅沟道隔离(STI)的关键技术。对STI的平坦化,基于CMP对不同密度图形研磨均匀性的考虑,传统的浅沟道隔离平坦化(STI CMP)工艺已经无法满足要求。直接浅沟道隔离平坦化(DSTI CMP)工艺由于使用了高选择比的二氧化铈研磨液,具有更好的片内平整度(Within wafer uniformity)...
in Electrical Engineering, Physics, Chemistry or other related technical field is required, or BS +3 years’ experience in engineering or related discipline 2. Understanding semiconductor fabrication process, material, physics, device and concepts. 3+ years of Process Development and/or Process ...
in Electrical Engineering, Physics, Chemistry or other related technical field is required, or BS +3 years’ experience in engineering or related discipline 2. Understanding semiconductor fabrication process, material, physics, device and concepts. 3+ years of Process Development and/or Process ...
The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to ... RK Singh,R Bajaj,M Moinpour,... 被引量: 0发表: 2014...