Advanced W-CMP Process Development for CMOS Logic Fabrication at 28mn Technology Node and BeyondTungsten has been widely used for the formation of contact via connecting to metal lines in IC fabrication. In this application, pre-metal layer was patterned by litho and etch process followed by ...
In this experiment, a non-zero alignment strategy using new mark designs has been tested on the backend layers of a 0.35 micrometers CMOS process. New mark designs have been evaluated, where the space part of the gratings has been filled with 'segments' of various width, the purpose being ...
A robust and innovative method of fabrication of on- chip capacitive digital isolators integrated in a high precision analog CMOS process is presented in t... P Mahalingam,D Guiling,S Lee 被引量: 0发表: 2007年 Design and implementation of system-on-package for radio and mixed-signal applicati...
ulsi铜互连工艺中的cmp研究摘要ulsi铜互连工艺中的cmp研究摘要:对于当今半导体制造工艺而言,具有诸多优点的铜代替传统的铝进行电路 互连,解决了一系列的电路电学缺陷,但与此同时也因其工艺的复杂的自身材料 的特殊原因,在制造过程中又出
化学机械平坦化(CMP)是IBM公司于20世纪80年代后期发展CMOS产品时研 发成功的一项新的工艺技术,并在1990年成功应用于动态随机存贮器(DRAM)的生 产中。1995年以后,CMP技术得到了迅速发展,成为半导体集成电路制造工艺中不可 或缺的一步。 近年来,随着半导体产业的迅速发展,半导体芯片(die)不断地朝微型化、高 ...
CMPisnowastandardprocessofICfabrication.The purposeoftheprocessistoachieveahighlevelofflatnessby removinginter-layerdielectric(ILD)ormetaloverburden.In thepolishingofthemetaloverburden(e.g.copper),dishingand erosiontakeplace.Thesetermsrefertothepreferentialremoval ...
“CMP has a long experience providing smaller organizations with access to advanced manufacturing technologies, and there is very strong interest in the CMP community in designing and prototyping ICs using this process,” said Jean-Christophe Crébier, director of CMP. “It is an opportunity for ma...
We present the fabrication of flexible single-crystalline 4H-silicon carbide (SiC) nanomembranes (NMs) with a centimeter size. The 4H–SiC NMs has been rel... C Wang,A Yi,P Zheng,... - 《Optical Materials》 被引量: 0发表: 2021年 Production mannered null based formation of the CMOS com...
摘要: PROBLEM TO BE SOLVED: To provide a polishing head for a CMP apparatus for manufacturing semiconductor elements enabling the measurement of a step height difference between a wafer and a retainer ring in a CMP process, and the CMP apparatus including the same....
SMT-18_CMP_CD SemiconductorManufacturingTechnology MichaelQuirk&JulianSerda©October2001byPrenticeHall Chapter18 ChemicalMechanicalPlanarization SemiconductorManufacturingTechnology byMichaelQuirkandJulianSerda ©2001byPrenticeHall Objectives Afterstudyingthematerialinthischapter,youwillbeableto:1.Describetheterminology...