There remains a continuing need for better cleanliness in semiconductor manufacturing environments. One particular area includes the mounting of chemical mechanical planarization (CMP) cleaning brushes onto process tools. Handling of brushes removed from standard packaging by gloved worker hands followed by ...
While the company has not officially confirmed the plan, it follows global efforts to straighten material supply chains as chipmakers ramp up the construction of cutting-edge fabs in these regions. The investment, doubling Fujifilm's semiconductor materials spending over the past three years, targets...
The most recent semiconductor devices aim for ultramicronization, high-speed action signal, low consumption of electric power and low cost, hence wafer diameter has increased, in order to achieve improved productivity and lower costs. As micronization reduces the interconnection space and the ...
Traditionally, Run-to-Run (R2R) controllers for semiconductor manufacturing processes are mostly process-centric, meaning the R2R controllers are typically... Y Sun,T Bormann,A Gondorf 被引量: 0发表: 2015年 加载更多研究点推荐 Fuzzy Predictive R2R Control FPR2R CMP Process chemical mechanical ...
A cleaning chemistry for lowering defect levels on the backside of a semiconductor wafer after chemical mechanical planarization (CMP). In a preferred embodiment of the present inve
market trends in the semiconductor and other industries; and other matters. These statements involve risks and uncertainties, and actual results may differ. These risks and uncertainties include, but are not limited to, our ability to effectively integrate the acquired company; market conditions ...
again meaning that the hydrolysis reaction for forming Si-O-H is dominant, rather than chemical oxidation occurring during CMP, as shown inFigure 2d. However, the extent of the hydrolysis chemical reaction itself does not explain why the Si wafer polishing rate with EDA was remarkably higher tha...
works, such as semiconductor masks. "The Program" refers to any copyrightable work licensed under this License. Each licensee is addressed as "you". "Licensees" and "recipients" may be individuals or organizations. To "modify" a work means to copy from or adapt all or part of the work...
With head lapping the sigma for uniformity is lower, meaning the variation is smaller. Hence, lapping reduces the process variation in terms of uniformity. Head lapping machine characterization is not available so head lapping itself is not uniform. There is a need to know the lapping rate of ...
20060160272Synthesis method for a compound used to form a self-assembled monolayer, compound for forming a self-assembled monolayer, and layer structure for a semiconductor componentJuly, 2006Effenberger et al. 20160118391DEUTERIUM ANNEAL OF SEMICONDUCTOR CHANNELS IN A THREE-DIMENSIONAL MEMORY STRUCTUREApr...