The smaller interconnect pitch gives greater signal attenuation, crosstalk, and dispersion per unit length. Therefore, we have a complex trade-off between signal delay, losses, crosstalk, dispersion, reflection, characteristic impedance, and spatial density.; Here we discuss the analysis of lossy ...
4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect
An approach to optical interconnect networks at the module level is presented that addresses the requirements imposed by electronic system manufacturing, such as thermal stability, low cost, and compatibility with standard electronic design, fabrication, and assembly processes. Research is presented on pol...
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Current-mode full-duplex (CMFD) signaling for high-speed chip-to-chip interconnect In this work we propose a new current-mode full-duplex (CMFD) signaling scheme for high-speed chip-to-chip data communication. In this scheme, all the inte... PVS Rao,P Mandal - 《Microelectronics Journal...
Custom LGA connectors are possible with rapid lead times to meet your demanding interconnect schedule. Our system is designed to meet the needs of customers from 10 to 10,000 units, with infinite custom height and pitch variations possible. And with contact heights as low as .030”, stack ups...
摘要: Signaling rates up to 20 Gb/s on a flex-circuit chip-to-chip interconnect are reported in active testing based on 90-nm CMOS circuits. The characterization of two flex connector prototypes demonstrates their basic durability and good high-frequency performance....
CHIP-TO-CHIP OPTICAL INTERCONNECT 专利内容由知识产权出版社提供 专利名称:CHIP-TO-CHIP OPTICAL INTERCONNECT 发明人:Peter Winzer,David Neilson,Po Dong 申请号:US1668814 4 申请日:20191119 公开号:US20200158964 A1 公开日:20200521 专利附图: 摘要:An optical interconnect circuit for transmitting data between...
“Avicena’s demonstration of record low power consumption with its LightBundle interconnect technology is proof of the advances Lumileds has made in microLEDs,” says Willem Sillevis-Smitt, Head of Marketing at Lumileds. “We are looking forward to enabling vastly lower power in data center int...
United States Patent US10416378 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text