NVIDIA® NVLink®-C2C extends the industry-leading NVLink technology to a chip-to-chip interconnect. This enables the creation of a new class of integrated products with NVIDIA partners, built via chiplets, allowing NVIDIA GPUs, DPUs, and CPUs to be coherently interconnected with custom sili...
High performance electronic systems require closely packed chip-to-chip interconnections in order to obtain shorter interconnection length and to accommodate the large number of I/O pads of VLSI chips. The smaller interconnect pitch gives greater signal attenuation, crosstalk, and dispersion per unit ...
Poled plasma polymers to produce stable on chip modulators for chip to chip optical interconnect We have presented the architecture of a silicon nanocomposite photonic interconnect structure based on using an off chip broad band light source and precis... RM Kubacki - Biophotonics/optical Interconnects...
4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect
MEMS chip-to-chip interconnects A chip-to-chip interconnect system suited for MEMS that do not require low-resistance connections is described. The interconnects may be fabricated simultaneously with MEMS ribbon structures such as are found in MEMS optical modulators. DM Bloom,Matthew A. Leone,Richa...
implementedasparallelinterconnectbuses.Thesupportedclockfrequencyofsuchwiredinterconnects-atbest-remainsconstantunderscaling,but-forglobalinterconnects-reducesbyafactoroffour,asthestructuresizeisreducedbyhalf.Suchmulti-conductorinterconnectsalsoexhibitsomeundesirablepropertieswhenusedforchip-to-chipcommunication.Themuchlarger...
TheNVIDIA Grace™ CPU Superchipcomprises two CPU chips connected, coherently, overNVLink®-C2C, a new high-speed, low-latency, chip-to-chip interconnect. The Grace CPU Superchip complements NVIDIA’s first CPU-GPU integrated module, theGrace Hopper Superchip, announced last year, which is ...
The push for homogeneity has tenuous beginnings. Some say that PCI Express is more an I/O than a processing bus and that Serial RapidIO targets backplanes; HyperTransport's developers claim that it is the most efficient chip-to-chip interconnect. It appears that the standards drafters, however,...
HSIC (High-Speed Inter-Chip) is an industry standard for USB chip-to-chip interconnect with a 2-signal (strobe, data) source synchronous serial interface using 240 MHz DDR signaling to provide only high-speed (480 Mbps data rate). No external cables or connectors and hot plug-n-play are...
United States Patent US10416378 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text