The package substrate combines in a single package substrate the advantages of rigidity, strength and relatively low CTE of a fibrous material with the capacity of a non-fibrous material to achieve fine resolution signal metal lines.Wang, Wen-chou...
This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988 and reports on developments in this technology for IBM applications since its adoption in 2000. These laminated substrates are nonuniform structures composed of three elements: a core, build-up laye...
build-up substrate and a method for manufacturing and semiconductor integrated circuit package that on the circuit board for the insulating layer and the wiring pattern layer to produce a build-up substrate laminated of a method for double-sided or single-sided circuit board comprising: (i) a wi...
The build-up package is formed on the transparent circuit carrier board, wherein the dielectric layer covers the optoelectronic chip and has a plurality of through holes, the wiring layer is formed on the dielectric layer and is electrically connected to a substrate wiring layer of the ...
These LSIs with signal travelling at high speeds also causes GHz band signal to travel through the package substrate. If the dielectric loss tangent of the insulation material is large, not only will it lead to high signal losses, it will also cause other problems such as increase in heat ...
This prepreg (1) for build-up is provided with a fiber substrate (2) and with a resin layer provided on both sides thereof. Conforming to IPC-TM-650 Method 2.3.17, the resin flow of the prepreg measured after heating and pressing for 5 minutes under conditions of 171±3°C and 1380±...
10. A method of building up a microelectronic die package, the method comprising: coupling an resin layer onto a metal film; coupling a release layer onto the resin layer; adhering the release layer to a substrate with a weak adhesion bond; etching the metal film, defining a cavity; and ...
The cross-sectional image below shows the incorporation of ABF into the substrate of an IC package, substrate-like PCB, or HDI PCB. The main properties of ABF that are meaningful for use in HDI PCBs and packages are the dielectric constant (Dk and Df) and the CTE value. The CTE value ...
Fine Line Photolithography and Ultra High Density Package Substrate for Next Generation System-on-Package (SOP) Rapid changes will continue in the trend toward system integration and microminiaturization. System-on-a package (SOP) is a highly integrated packaging sol... F Liu,V Sundaram,B Wieden...
The solder-joint reliability of solder-bumped wafer level chip scale package (WLCSP) on microvia build-up printed circuit board (PCB) subjected to thermal ... JH Lau - 《Circuit World》 被引量: 0发表: 2000年 Thermo-mechanical finite element analysis in a multichip build up substrate based ...