网络增层式基板;增层基板;层板 网络释义
Since 1996, we have provided a build-up PWB named "DV-MULTI (Dimple Via-MULTI layer boards)", which is the ultra high-density build-up substrate with excellent reliability for the high-density devices, e.g. barechip and CSP.etc. Although the semiconductor packaging customers require our ...
专利名称：BUILD-UP SUBSTRATE 发明人：SUZUKI KATSUHIKO,鈴木 克彦申请号：JP特願平10-265132 申请日：19980918 公开号：JP特開2000-101237(P2000-101237A)A 公开日：20000407 专利内容由知识产权出版社提供 专利附图：摘要：Array 申请人：FUJITSU LTD,富士通株式会社 地址：神奈川県川崎市中原区上小田中4丁目1番...
摘要: PROBLEM TO BE SOLVED: To provide a process for manufacturing a build-up substrate in which outflow of the resin layer in a build-up layer to a cable does not take place, and the material of a flexible substrate is not limited....
AUSTIN, TX – The shortage of build-up substrates will increase this year, compared to 2021, and the gap between supply and demand will loom even larger in 2023, according to TechSearch International. Many substrate makers are adding capacity, but it tak
United States Patent US6960518 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text
Semiconductor Manufacturing IEEE Transactions onE. Sachs, A. Hu and A. Ingolfsson, Run by run process control: combining SPC and feedback control. ... E Sachs,A Hu,A Ingolfsson - 《Semiconductor Manufacturing IEEE Transactions on》 被引量: 602发表: 1995年 Emerging Directions For Packaging Tec...
Buildup substratecoefficient of thermal expansionflip-chipmicro-viathrough-holeFlip-chip bonding on organic sequential buildup substrate technology has been an essential part of semiconductor packaging. In the quest for an ever higher semiconductor performance, there has been a rapid...
摘要: To provide a printed circuit board, a buildup substrate and a method of manufacturing the printed circuit board capable of curbing a transmission loss thereof at a desired frequency.收藏 引用 批量引用 报错 分享 文库来源 求助全文 Printed circuit board, a buildup substrate, a meth 优质...
METHOD FOR PRODUCING BUILD-UP SUBSTRATE A method for producing a build-up substrate containing two layers of wiring patterns that are separated from each other with an insulating film intervening therebetween and are electrically connected to each other at a contact part penet... T Kamakura,A Tsun...