1. 基于层布局 ...r) 基于时间布局(Time-oriented) 基于层布局(Substrate-based) 基于手工布局(Hand-made) Visual Complexity比较 全面地收 …wenku.baidu.com|基于3个网页 例句 释义: 全部,基于层布局 更多例句筛选 1. A resistance macromodel for deep - submicron process epi- type substrate based on the...
一种去中心化的奖励机制。 为平行链贡献者发明的一个去中心化的、由社区管理的奖励机制。也可作去中心化和可持续的报酬。 大家好,本文是Substrate-based专题的第五篇笔记,也是在Hackusama上… 阅读全文 Unique Network 一条Kusama网络中为游戏而设计的NFT链 大家好,本文是Substrate-based专题的第四篇笔记,也是...
A.; Neretina S.; Substrate-based galvanic replacement reactions carried out on heteroepitaxially formed silver templates, Nano Res. 2013, 6, 418-428.Gilroy K D, Farzinpour P, Sundar A, Tan T, Hughes R A and Neretina S 2013 Substrate-based galvanic replacement reactions carried out on ...
The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the side opposite the chip, conductor tracks provided with soldering globules. The conductor tracks...
专利名称：Substrate-based IC package 发明人：Martin Reiss,Steffen Kroehnert 申请号：US10868516 申请日：20040615 公开号：US07030473B2 公开日：20060418 专利内容由知识产权出版社提供 专利附图：摘要：The invention relates to a substrate-based IC package that includes a substrate on which a chip is ...
Sorolla, Polypropylene-substrate-based SRR- and CSRR- metasurfaces for submillimeter waves. Opt. Express 16: pp. 18312-18319 M Aznabet,M Navarro-Cía,SA Kuznetsov,... - 《Optics Express》 被引量: 44发表: 2008年 Polypropylene-substrate-based SRR- and CSRR- metasurfaces for submillimeter waves...
Contacting method for substrate-based switches and accompanying switch assemblyThe method involves arranging a contact side (16) of a flexible film (10) with a contact side (26) of a fixed substrate (20). A stable electromechanical connection between the substrate and the film is produced by ...
A three-dimensional packaging structure based on a flexible substrate and a manufacturing method for same, said method comprising: providing a bendable contiguous flexible substrate (104), the size whereof is determined by the size, quantity, and shape of chips, and arranging wiring on the surface...
专利名称：Flexible-substrate-based three-dimensional packaging structure and method 发明人：Xueping Guo,Yuan Lu 申请号：US15036090 申请日：20140612 公开号：US09997493B2 公开日：20180612 专利内容由知识产权出版社提供 专利附图：摘要：The present invention mainly relates to a 3-D packaging structure ...
专利名称：FLEXIBLE-SUBSTRATE-BASED THREE- DIMENSIONAL PACKAGING STRUCTURE AND METHOD 发明人：GUO, Xueping,郭学平,LU, Yuan,陆原 申请号：CN2014/079777 申请日：20140612 公开号：WO2015/070599A1 公开日：20150521 专利内容由知识产权出版社提供 专利附图：摘要：A three-dimensional packaging structure based on...