zen5传感器位置有改动,且限制频率方式从上代温度墙(95°C)改成了功耗墙(96/9700X统一88W PPT)。检测软件里zen5显示的数据仅供参考,不能和zen4精确对比,I家同理。但因为zen4和zen5核心布置方式还有顶盖材质基本一致(layout和IHS),所以温传误差不会很大;根据GN测试,在21-22°C室温、相同全核负载、功耗相同88...
resistance, which AMD says allows the chip to operate at a 7C lower temperature than a Zen 4 chip running at the same TDP. AMD also focused on a more intelligent layout of hot spots on the die, improved sensor placement, and revamped temperature control algorithms to keep temperatures in ...
The AMD Ryzen 9 9950X is the top-end chip, while the 9700X is the higher-end single CCD Ryzen 9000 CPU. For those unfamiliar with AMD’s modern processor design, it constructs CPUs from chiplets, each with 8 CPU cores. Sometimes, this layout can lead to differe...
The question is – why did AMD put such a pci-e 5.0 controller in the chip, instead of using this budget for a more advanced integrated video chip, at the level that we are promised in Zen4 Phoenix? This would be a much more balanced solution for top cpu, especially if the discreet...
Thats why it needs to be the whole thing on 4nm node Wont be cheap either. Posted on Jan 15th 2025, 3:41 #18 Daven dragontamer5788Strix Halo is intended for 45W laptops to 120W Desktops btw. 45W is "desktop replacement laptop", very high power usage for laptops but technically...
AMD will probably use the Zen4c CCX layout in PHX2 going forward so they can make the APU smaller and cheaper to produce. It should also improve the low power performance since the v/f curve will be different. Squared said: SemiAnalysis also said that Zen4 has hard lines between vari...
user1 Ancient Guru Messages: 3,049 Likes Received: 1,511 GPU: Mi50 MOD Review seems to be lacking in data, assuming that hilbert will update it later also I really wish people would stop using aida as a memory benchmark, its legit bugged on zen4 and zen5 and they havent bothered ...
Solved: Mainboard: MSI x570 Unify Mainboard-BIOS: 7C35vA82 (Beta version) CPU: Ryzen 5900x RAM: Crucial Ballistix BL2K32G36C16U4B 3600 MHz, 64GB (32GB x2)
With Zen 4, AMD has moved to TSMC’s 5-nanometer process for the CCDs and 6-nanometer for the redesigned I/O die. With the new 5n process node, the CCD size has shrunk from almost 81 mm² to 70 mm² but has more than a 50% increase in transistor density, moving from 2.09 ...
The Ryzen 7 5800X3D, the world's first processor with a 3D-stacked cache, is now the fastest gaming CPU ever created.