wafer uniformity是晶片均匀性，区别在于across是跨越，横跨的意思，withing则是在什么范围内
Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control profile for a chemical mechanical planarization process to more uniformly and consistently achieve the desired ...
网络晶圆内;内的均匀性;晶片内 网络释义
The within-wafer uniformity of pattern transfer on the suce of a large-size wafer is poor. This is usually caused by uneven film thickness and etching rate.A.正确B.错误的答案是什么.用刷刷题APP,拍照搜索答疑.刷刷题(shuashuati.com)是专业的大学职业搜题找答案
ahigh uniformity across an entire wafer. In addition, various[translate] a他使我想起了你 He caused me to remember you[translate] aI know , It's not good to talking about those 我知道,它对于谈论那些不是好的[translate] aAny claim JLH may make for adjustment in accordance with this Article...
Within-wafer removal rate non-uniformity (WIWRRNU) is a critical parameter to determine film thickness planarity on a wafer-scale level and it grossly ... C Wu,C Wu 被引量: 1发表: 2015年 A Combined Gas Cluster Ion Beam (GCIB) and Chemical-Mechanical Polish (CMP) Planarization Scheme for...
“fly’s eye” illuminator, which is arranged to provide a desired angular distribution of the radiation beam 1221, at the patterning device MA, as well as a desired uniformity of radiation intensity at the patterning device MA (as shown by reference 1260). Upon reflection of the beam 1221 ...
(ILD) of a wafer;a controller for determining a polish recipe using the thickness profile, wherein the polish recipe is configured to substantially compensate for a non-uniformity of the thickness profile;a high-rate CMP platen configured to perform a high-rate CMP process on the ILD using ...
Within-wafer uniformity is traditionally measured by the signal-to-noise ratio (SNR), defined as the estimated standard-deviation of within-wafer measurements over the mean of those measurements, Unfortunately, in the presence of deterministic variations of the response over the wafer (such as the ...
Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control profile for a chemical mechanical planarization process to more uniformly and consistently achieve the desired ...