Method and apparatus for providing a deposition process with improved etch resistance variable for the ARC wafer to wafer uniformity is improved, particulate contamination of reduced (TERA) layer. More specifically, to improve the wafer to wafer uniformity by reducing the number of contaminant ...
Approximately 30 cells/well were seeded on 12-well plates and left to settle for 1 h before exposure. Six replicate wells were exposed to each NM concentration (CeO2and TiO2NMs: 1.14, 3.8, 11.4, 38, 114 and 380 μg/ml; Ag NMs: 0.038, 0.114, 0.38, 1.14, 3.8, 11.4 μg/ml), NC ...
Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization Here we use two-dimensional models of fluid film lubrication and contact mechanics to calculate the contact stress and fluid (i.e., slurry) pressure distri... I Hu,TS...
Functionality being removed or changed The regionprops function uses new equation for circularity Behavior change 4-4 Starting in R2023a, the regionprops function uses a new equation to calculate circularity. The new equation removes a bias that caused the computed circularity to be too high for ...