“Closed-Form Expression for Interconnection Delay, Coupling and Crosstalk in VLSI's,” by Takayasu Sakurai; IEEE Transactions on Electron Devices, vol. 40., No. 1, Jan. 1993; (8 pages). “Multilevel Metal Capa
Distributed model of a typical three-dimensional VLSI interconnect structure. The capacitance of a wire is a typical component in nearly all interconnect models. The inclusion of resistive and inductive parameters in the modeling of interconnects is a recent trend. The scaling of devices reduces the...
This paper studies the step-response of RC wires with source resistance R/sub S/ and load capacitance C/sub L/, which is the most commonly used model for a wire in VLSI circuits. In particular, we obtain the normalized values of some of the common threshold-crossing times at the output...
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Therefore, a system and method that could offer accurate modelling of bondwire interconnects in a short amount of time, and produce models that can easily be co-simulated with integrated circuit netlists, would be of great benefit to IC designers over the prior art. ...
Through reduction, a small macro model of a network, or portion of a network, is created having few nodes, where the nodes are the potential sites for decap connection. The charge-based constraints then govern the charge transfer from the decaps to the rest of the network in the VLSI ...
Eugenio Culurciello, et al., “Capacitive inter-chip data and power transfer for 3-D VLSI” IEEE Trans. Circuits Syst. II, vol. 53, No. 12, pp. 1348-1352, 2006. Geoffrey Marcus, et al., “A Monolithic Isolation Amplifier in silicon-on-isolator CMOS: Testing and Applications”, Ana...
Looking ahead, several key areas offer opportunities for progress and innovation in this field: (1) The development of advanced modeling and simulation techniques can aid in the optimization of the cutting process. By utilizing computational models, the complex interrelationships among the cutting tool...