“Closed-Form Expression for Interconnection Delay, Coupling and Crosstalk in VLSI's,” by Takayasu Sakurai; IEEE Transactions on Electron Devices, vol. 40., No. 1, Jan. 1993; (8 pages). “Multilevel Metal Capa
Distributed model of a typical three-dimensional VLSI interconnect structure. The capacitance of a wire is a typical component in nearly all interconnect models. The inclusion of resistive and inductive parameters in the modeling of interconnects is a recent trend. The scaling of devices reduces the...
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Eugenio Culurciello, et al., “Capacitive inter-chip data and power transfer for 3-D VLSI” IEEE Trans. Circuits Syst. II, vol. 53, No. 12, pp. 1348-1352, 2006. Geoffrey Marcus, et al., “A Monolithic Isolation Amplifier in silicon-on-isolator CMOS: Testing and Applications”, Ana...
Through reduction, a small macro model of a network, or portion of a network, is created having few nodes, where the nodes are the potential sites for decap connection. The charge-based constraints then govern the charge transfer from the decaps to the rest of the network in the VLSI ...
Looking ahead, several key areas offer opportunities for progress and innovation in this field: (1) The development of advanced modeling and simulation techniques can aid in the optimization of the cutting process. By utilizing computational models, the complex interrelationships among the cutting tool...