Typical VLSI interconnect has both resistance and inductance; this formulation relies on, as well as takes advantage of this property. For the example seen in Figure 8.27 we would have: Ag+Al=(10−1000010−1) As the third and fifth columns from Ag + Al are created from non-zero ...
19. A wire load model creation tool, comprising: means for creating an interconnection configuration for a structure; means for field solving the interconnect configuration to determine parasitic information, wherein the parasitic information comprises capacitance and resistance information; means for storing...
low design complexity, and low power. In such architectures, communication over global wires has a significant impact on overall processor performance and power consumption. VLSI techniques allow a variety of potential wire implementations, but VLSI wire properties have never been exposed to microarchitec...
Through reduction, a small macro model of a network, or portion of a network, is created having few nodes, where the nodes are the potential sites for decap connection. The charge-based constraints then govern the charge transfer from the decaps to the rest of the network in the VLSI ...
The equation for the normal load Fnij of any given abrasive can be expressed as follows, in which Clhij represents the depth of a lateral crack, Clwij denotes the width of the lateral crack, k is a dimensionless constant (k = 0.226) [36], and ν represents the Poisson’s ratio value...