关键词: chemical mechanical polishing planarisation light interferometry statistical analysis process control blanket polish rates wafer-to-wafer variation interferometry signals nonendpointed chemical-mechanical polishing blanket removal rates pos DOI: 10.1109/TSM.2002.804900 被引量: 10 ...
the flat through the center of the wafer to the opposite edge of the wafer. (Perpendicular to ...
A method for extracting wafer-to-wafer thickness variation from interferometry signals off patterned (product) wafer polish during non-endpointed CMP. The method includes sensing sample signals representing polishing trace from product wafers near the end of polishing period from at least two product ...
Using single-molecule fluorescence imaging, we demonstrate these sacrificial nanofluidic chips can function to controllably and completely stretch lambda DNA in a two-dimensional nanofluidic network comprising channels and pillars. The flexible nanofluidic structure design, wafer-scale fabrication, single-digit...
The variation of wafer warpage along the fabrication process was observed in experiments [31]. The fabrication process of the metal interconnect lines increased the wafer warpage due to the large CTE mismatch between the metal material and Si substrate. A bending theory of a bi-metal strip under...
In-line measurements are used to monitor semiconductor manufacturing processes for excessive variation using statistical process control (SPC) chart techniques. Systematic spatial wafer variation often occurs in a recognizable pattern across the wafer that is characteristic of a particular manufacturing step....
This control control equipment 112 in order to revise the CD variation which it occurs with lithography processing before the etching processing, adjusts the temperature of each exothermic body at the time of processing which decreases the variation of minute size between each setting position making...
Monitor wafers are the bare silicon wafers to be used in the case that an adjustment is required in each production step prior to the actual IC production. For example, when the conditions of each process are set, such as the case of measuring tolerance of device against ( the variation of...
While the wafer-to-wafer non-uniformity (WTWNU) and within-wafer non-uniformity (WIWNU) are superior to conventional silica-based slurry, the level of... SI Lee,J Hwang,H Kim,... - 《Microelectronic Engineering》 被引量: 38发表: 2007年 A model for wafer scale variation of removal rate...
How is Within Wafer (variation) abbreviated? WIW stands for Within Wafer (variation). WIW is defined as Within Wafer (variation) somewhat frequently.