Plastic Frame / Wafer Frame / Wafer Ring / 晶圆框架,主要搭配晶圆切割机使用,用于晶圆研磨、切割时之固定外框,切割完成也可直接出货。特殊材质设计,具有轻量化、抗静电優点。 ● 可雷雕、刻字 可依客戶需求,产品品名、LOGO、批量序号、制造年月日、英数字等資料皆可写入。
8英寸晶圆框架运输盒,防静电晶舟盒,铁圈包装盒,钢圈运输盒,wafer ring晶圆盒,Wafer Frame Box 承载晶圆黏片的框架铁环,隔离保护晶圆。抗静电材料,轻量化设计,结构强化设计有效增加产品结构&寿命。使用在制程工站与站别运输、储存。
APPLIED MATERIALS (AMAT) 0040-32463 RING, MAGNET, UPPER EDWARDS VACUUM INC RS0038239 STOKES HV PUMP W/BLOWER 306-042H OXY- refurbished w AMAT 0010-40316 ANTENNA T&T STYLE COOL MODULE AMAT 0224-42327 THRTL VALVE ASSY, NITRIDE W/KALRE ...
A FOUP carrier has a five-sided box with an open front. A door attaches to the front of the box, to seal the box against entry of external contaminants, to help keep the wafers clean. The door has a latch mechanism, which is typically adapted to be engaged and operated automatically ...
Kawasaki has the No.1 market share in the wafer transfer clean robots.The original drive mechanism provides highly accurate and rigid operations.A single robot can access 2, 3 and 4FOUPs of EFEM without a track.Compatible with SEMI-F47 and SEMI-S2 standards.Transfers of ring frames and ...
ASYST 9750-2000-00 MODEL SMIF-300FL, S3, 25WFR; FOUP Loadport with Hermos FOUP- AMAT 0010-39339 200MM SWLL LLB SINGLE SLOT WAFER LIFT HO EDWARDS 085-041-016 RTR. & DRV. SHFT. UNOAWA #15 EDWARDS 085-041-017 ROTOR & DRIVEN SHAFT. UNOAWA #15; PARTS FOR DRY VACUUM PUMP EBARA C...
The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility....
The present invention relates to a wafer flip device and a wafer flip method capable of stably adsorbing and separating only a wafer from a jar box and preventing spacing members from adhering to the wafer, when moving the wafer stored in a jar box to a front opening unified pod (FOUP)....
主营: 晶圆传送盒;晶圆包装盒;硅片盒;花篮;FOUP 进店 ¥0.0 ¥680.0 ¥0.0 经销批发 | 江苏昆山市 昆山英博尔电子科技有限公司 主营: 半导体封装;led封装;wafer frame/cassette;晶圆贴片环;晶圆框架盒 进店 ¥9.0 ¥330.0 ¥1100.0 生产加工 | 江苏昆山市 苏州砚博电子科技有限...
PROBLEM TO BE SOLVED: To solve a problem in that when each wafer is transferred between FOUP and the sample chamber of a wafer processor, the wafer passes via a mini-environment device surrounded by air atmosphere, the wafer is consequen... S Motohiro,住野谷 基博 被引量: 0发表: 2015年...