MPI’s WaferWallet®ULTRA is load port designed for 300 mm FOUP automated loading/unloading by Automated Material Handling Systems (AMHS) required in production test environments, especially when testing PIC (Photonic Integrated Circuits) devices. Like all other MPI WaferWallet® options, WaferWall...
Controller Model 1200 Applicable to SECS possible Applicable to AGV impossible Applicable to SMIF/FOUP impossibleA Summary of Process Performance Pyro.Ox Thick film Pyro.Ox Thin film P-D-Poly Poly-Si HTO Si3N4 TEOS Reaction gas O2.H2 O2.H2 SiH4.PH3.H2 SiH4 SiH2Cl2.N2O SiH2Cl2.NH3 Si(C2H5...
But I think I'm lost if we're talking about "lot size" = a group of wafers in a carrier (FOUP or other)... nine 200mm wafers have the same area (aside from a few percent in edge effects) as four 300mm wafers, so if each of them contains the same number of dice, why ...
9802005 1 优惠优惠 AMAT / APPLIED MATERIALS FABS-202 1 优惠优惠 AMAT / APPLIED MATERIALS Robot for AE Minos 1 优惠优惠 AMAT / APPLIED MATERIALS Rorze RR6140 1 优惠优惠 AMAT / APPLIED MATERIALS VHP 2 提供的优惠 AMAT / APPLIED MATERIALS ...
For the 2000s and emergence of 300-mm wafers, the complementary need for intrabay automation will be driven by ergonomics; a fully loaded 25-wafer carrier or front-opening unified pod (FOUP) i...
Evans M (2006) FOUP loading load lock. US patent, US 20060285944 A1 Ferrara J (2007) Work-piece processing system. US patent, US 20070243049 A1 Wang CN, Wang CH (2007) A simulated model for cycle time reduction by acquiring optimal lot size in semiconductor manufacturing. Int J Adv Manu...
lot information, lot priority, available routes, route distances, maintenance schedules, and/or other factors. The transfer of a FOUP between AMHSs may be broken down into sub-routes comprised of transfers within a single AMHS. In some embodiments, the route of a cross-fab transfer may be br...
性+这几您好，很高兴为您解答[鲜花]NPW+reclaim+wafer+的规格+A:+PA+B:研磨厚度,C+弯曲度+D电阻电性为：A: 直径尺寸，常见的有 2 英寸、3 英寸、4 英寸、6 英寸等。B: 研磨厚度，一般在几百微米到几十微米之间，需根据具体应用要求进行选择。C: 弯曲度，指晶圆在加工和使用过程中是否易...
The 4-link arm 6004 is advantageous in that it folds in a much smaller containment ratio than a 3-link SCARA arm 6002, but it reaches a lot further than a conventional 3-link SCARA 6002 for the same containment diameter. In combination with the ability to have a second drive and second...
Work pieces may be transferred in a cassette 8718 that the cart 8704 may lower to the FOUP 8708 using an elevator or vertical extension 8720. FIG. 88 illustrates an improved wafer handling facility in which a transport cart 6140 in a vacuum tunnel 6150 is installed beneath a factory floor....