as Li, Na, Mg, and Al, are difficult or impossible to analyze. To improve the detection capability of the analysis, vapor phase decomposition (VPD) was developed as a pre-concentration technique for TRXF.Analysis of Metallic Impurities in Si Wafers Using Fully Automated VPD-ICP-MS ICP - ...
Radian VPD ICPMS (Vapor Phase Decomposition) is a high-throughput, completely automated production tool for online monitoring of metal contamination on semiconductor wafers. The World’s Fastest, Most Automated VPD-ICPMS (VPD monitor).
VPD-DC-ICPMSNoble metallic contaminationOutplated and ionic form of contaminantsVPD-DC collection efficiencyIn this study, the collection efficiency of a diluted HF/HCl/HNO_3 solution to remove outplated and spin-coated noble metallic contaminants from the Si surface is investigated. The results ...
随着半导体器件加工尺寸的缩小,对抛光片表面金属离子含量的要求逐渐增加.传统手动VPD-ICPMS法测试金属离子含量已无法满足高规格半导体器件的生产.本文利用全自动VPD配合ICPMS分析的方法实现低于1×10~9atom/cm~2的最低检出限,同时能实现超过96%的回收率,满足高精度半导体加工的测试要求,类似的测试在国内外尚属首次. ...
Katsu, Analysis of Metallic Impurities in Si Wafers Using Fully Automated VPD-ICP-MS. (PerkinElmer Application Note, 2021), https://resources.perkinelmer.com/lab-solutions/resources/docs/app-analysis-of-metallic-impurities-in-si-wafers-using-fully-automated-vpd-icp-ms-224086.pdf. Accessed 29 Jan...
sample collection system with a state-of-the-art chemical delivery system that automatically provides all the chemicals for VPD and all the chemicals required for the calibration of the integrated ICP-MS analysis system. It is a complete measurement system under the control of one computer that ac...
VISL is a complete solution provider for wafer surface heavy metal contamination analysis which using VPD methodology of the equipment market.
VPD is most commonly combined with Total Reflection X-Ray Fluorescence (TXRF) or Inductively Coupled Mass Spectrometry (ICP-MS) for trace metal analysis. When comparing the two techniques, the combination of VPD with ICP-MS allows for the monitoring of almost the whole periodic table; including ...
S.H. Tan, Application of vapor phase decomposition techniques (VPD/AAS and ICP-MS) for trace element analysis in oxide coatings on silicon, Nucl. Inst. Methods Phys. Res., Sect. B 99 (1995) 458-461.Tan, S. H. Application of Vapor Phase Decomposition Techniques (VPD/AAS and ICP-MS)...
Bulk silicon etch (BSE) uses HF vapor and ozone gas to etch the implanted silicon wafer to a controlled depth allowing the detection of energetic contaminants (Ichikawa in Analysis of metallic impurities in Si wafers using fully automated VPD-ICP-MS. PerkinElmer Application Note, 2021, https://...