VT-4B5 IMS, Non-glass, 4.2W/mK VT-4B3 IMS, Non-glass, 3W/mK VT-5A2 (tec-thermal 5) IPC-4101E High Tg, High Thermal Conductivity laminates & prepreg VT-4A2H PP (tec-thermal 4) Thermally conductive Laminates & Prepreg VT-4A2H IMS (tec-thermal 4) Thermally conductive IMS本...
VT-4B5LMetal Base Laminate, 3.6W/m.k , Low Modulus, MOT 155N/A VT-4B5IMS, Non-glass, 4.2W/mKN/A VT-4B3IMS, Non-glass, 3W/mKN/A VT-5A2 (tec-thermal 5)High Tg, High Thermal Conductivity laminates & prepregN/A VT-4A2H PP (tec-thermal 4)Thermally conductive Laminates & Prepre...
爱企查为您提供深圳市腾南实业有限公司腾辉Ventec VT-901多层混合层压高速线路板 连接功能好 可定制等产品,您可以查看公司工商信息、主营业务、详细的商品参数、图片、价格等信息,并联系商家咨询底价。欲了解更多线路板、光模块、柔性板、pcb电路板、微波阶梯板信息,请访
thermal-bond 3.0F (VT-4B3H RCF) Thermally Conductive Resin Coated Film Bondply thermal-bond 5.0F (VT-4B7H RCF) Thermally Conductive Resin Coated Film Bondply pro-bond & thermal-bond: Flexible bondply materials for high-performance, high-reliability multilayer PCB stack-ups Our range of pro-...
VT-4B1 is designed for bending and forming with thermal conductivity of 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance: 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*...
Ventec高性能IMS 介质材料VT-4B5H获得UL 授权29 四月 2020Ventec国际集团有限公司(6672 TT),高兴地宣布,UL评价Ventec的高性能陶瓷、无补强的IMS介质材料已收到授权申请UL标志, 已被确认为达到电气和机械RTI最高工作温度(MOT) 155℃。 UL对Ventec的VT-4B5Hmetal基板的调查已经完成,并确定符合适用要求,包括155...
搜索… Product Name IPC Slash Sheet Product Type To Download Datasheets Select Below and Click Download TDS Download Datasheets Email me these documents TDS VT-4B3 Metal Base Laminate UL Approval: E214381 Version: 23/08/2023 General Information Thermal conductivity -- 3.0 W/mK Ceramic ...
thermal-bond 3.0F (VT-4B3H RCF)Thermally Conductive Resin Coated Film Bondply thermal-bond 5.0F (VT-4B7H RCF)Thermally Conductive Resin Coated Film Bondply pro-bond & thermal-bond: Our range of pro-bond and thermal-bond bondply dielectrics are formulated for high-speed signal integrity with...
thermal-bond 3.0F (VT-4B3H RCF) Thermally Conductive Resin Coated Film Bondply thermal-bond 5.0F (VT-4B7H RCF) Thermally Conductive Resin Coated Film Bondply pro-bond & thermal-bond: Flexible bondply materials for high-performance, high-reliability multilayer PCB stack-ups Our range of pro-...
Item Test Method (IPC-TM-650) Unit VT-4B5 SP 40um Thermal Conductivity ISO 22007-2 W/m*K 4.2 Thermal Impedance ISO 22007-2 ℃*in2/W 0.015 Tg DSC 2.4.25 ℃ 120 DMA 2.4.24.4 145 Td TGA ASTM D3850 ℃ 380 Thermal Stress Solder Dip @ 288℃ 2.4.13.1 Minute >=5 Hi-Po...