VT-4B5IMS, Non-glass, 4.2W/mK VT-4B3IMS, Non-glass, 3W/mK VT-5A2 (tec-thermal 5)IPC-4101EHigh Tg, High Thermal Conductivity laminates & prepreg VT-4A2H PP (tec-thermal 4)Thermally conductive Laminates & Prepreg VT-4A2H IMS (tec-thermal 4)Thermally conductive IMS...
VT-4B3 Metal Base Laminate General Information Thermal conductivity -- 3.0 W/mK Ceramic Filled Halogen Free Flammability UL94 V-0 MOT 130℃ Application LED Lighting Power Conversion Controllers Motor Drives Rectifiers Power Supply Laminate Properties ...
爱企查为您提供深圳市腾南实业有限公司腾辉Ventec VT-901多层混合层压高速线路板 连接功能好 可定制等产品,您可以查看公司工商信息、主营业务、详细的商品参数、图片、价格等信息,并联系商家咨询底价。欲了解更多线路板、光模块、柔性板、pcb电路板、微波阶梯板信息,请访
thermal-bond 3.0F (VT-4B3H RCF) Thermally Conductive Resin Coated Film Bondply thermal-bond 5.0F (VT-4B7H RCF) Thermally Conductive Resin Coated Film Bondply pro-bond & thermal-bond: Flexible bondply materials for high-performance, high-reliability multilayer PCB stack-ups Our range of pro-...
VT-4B1 is designed for bending and forming with thermal conductivity of 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance: 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*...
VT-4B5LMetal Base Laminate, 3.6W/m.k , Low Modulus, MOT 155N/A VT-4B5IMS, Non-glass, 4.2W/mKN/A VT-4B3IMS, Non-glass, 3W/mKN/A VT-5A2 (tec-thermal 5)High Tg, High Thermal Conductivity laminates & prepregN/A VT-4A2H PP (tec-thermal 4)Thermally conductive Laminates & Prepre...
VT-4B3H is a high Tg, ceramic-filled, thermally conductive (3.2 W/mK), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs requiring enhanced levels of heat management and thermal conductivity. Thermal-bond RCF can be combined with other Ventec laminate & prepre...
VT-4B5L, a high performance IMS material that offers excellent solder joint reliability and thermal conductivity of 4.0 W/mK.; VT-4B5H, a metal base laminate material with high Tg (180oC) and thermal conductivity of 4.2 W/mK., ideally suited for applications such as LED lighting, power ...
Ventec high performance IMS dielectric material VT-4B5H has received authorization to apply the UL mark
thermal-bond 3.0F (VT-4B3H RCF) Thermally Conductive Resin Coated Film Bondply thermal-bond 5.0F (VT-4B7H RCF) Thermally Conductive Resin Coated Film Bondply pro-bond & thermal-bond: Flexible bondply materials for high-performance, high-reliability multilayer PCB stack-ups Our range of pro-...