VT-47CCL/LaminateVT-47PP/Prepreg(ULfamilywithVT-481) ProfessionalManufacturerinCopperCladLaminates VentecElectronics(Suzhou)Co.,Ltd 168XiangYangRd SuzhouNewDistrict Jiangsu P.R.China215009 T:+8651268091810 F:+8651268081823 Email:sales@ventec .ventec-usa ...
VT-47CCL/LaminateVT-47PP/Prepreg(ULfamilywithVT-481) ProfessionalManufacturerinCopperCladLaminates VentecElectronics(Suzhou)Co.,Ltd 168XiangYangRd SuzhouNewDistrict Jiangsu P.R.China215009 T:+8651268091810 F:+8651268081823 Email:sales@ventec .ventec-usa ...
Desmearing Process 1. Desmear rate is less than that of the conventional FR4; 2. Adjustments to the desmear process are necessary for the lead-free materials; 3. Check with your chemical supplier for recommendations. Downloads for VT-47 Process Guide In...
VT-47NF-LFPP VT-47VF名称名称名称名称名称名称名称名称 VT-447 VT-447V VT-447 B CCL - TC名称名称名称名称名称名称名称名称 VT-441PP VT-441V PP名称名称名称名称名称名称名称名称 VT-441 VT-441V CCL - TC名称名称名称名称名称名称名称名称
VT-47 This Ventec material for PCB has a high temperature for glass transition and a great thermal reliability. In addition, it has UV blocking, as well as CAF resistance. Furthermore, it also has a low coefficient of thermal expansion at the Z-axis. It is lead-free compatible and has ...
VT-47LTIPC-4101E /126high Tg, Low CTE, high thermal reliability prepreg Hole Fill PrepregIPC-4101ELead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBs Organic FR4 phenolic cured substrates and ceramic-loaded hole-fill prepregs for environm...
VT-47 EN 45545-2:2013+A1:2015 resp. EN 45545-2:2020 - VT-47 - Railway applications – Fire protection on railway vehiclesPart 2: Requirements for fire behavior of materials and components Download VT-441V European Standards for Railway Rolling Stock (VT-441V) R25 VT- 441V, Ignition, Sm...
VT-47PPVT-47NF-LFPPVT-47VF 下载 下载 下载 下载 下载 下载 下载 下载 VT-447VT-447VVT-447 B CCL - TC 下载 下载 下载 下载 下载 下载 下载 下载 VT-441PPVT-441V PP 下载 下载 下载 下载 下载 下载 下载 下载 VT-441VT-441V CCL - TC 下载 下载 下载 下载 下载 下载 下载 下载 VT-461 ...
VT-47LT IPC-4101E /126 high Tg, Low CTE, high thermal reliability prepreg Hole Fill Prepreg IPC-4101E Lead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBs Organic FR4 phenolic cured substrates and ceramic-loaded hole-fill prepregs for ...
VT-47 IPC-4101E /97 /98 /99 /101 /126 Phenolic Cured, Filled, Low CTE FR4.0 Tg 180 Hole Fill Prepreg IPC-4101E Lead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBs Organic FR4 phenolic cured substrates and ceramic-loaded hole-fill...