Ultra Large Scale Integration 超大规模集成电路(=ULSI) large scale integration n. [电] 大规模集成化 large scale integration technology 【计】 大规模集成技术 very large scale integration (VLSI) 超大规模集成,超大规模集成电路,甚大规模集成电路 large scale map 大比例尺地图,大比例尺图 large sca...
Ultra large-scale integration (ULSI) is the process of integrating or embedding millions of transistors on a single silicon semiconductor microchip. ULSI technology was conceived during the late 1980s when superior computer processor microchips, specifically for the Intel 8086 series, were under developm...
Ultra Large-Scale Integration Design - ScienceDirectSaburo Muroga aELSEVIEREncyclopedia of Physical Science and Technology (Third Edition)
One of the main requirements for ultra-large-scale integration (ULSI) is atomic-order control of process technology. Our concept of atomically controlled processing for group IV semiconductors is based on atomic-order surface reaction control in Si-based CVD epitaxial growth. On the atomic-order su...
The introduction of low-k/ultra-low-k (ULK) dielectric materials to accommodate the continuous scaling down of the feature sizes of IC chips to improve the device density and performance of the ultra-large scale integrated (ULSI) circuits represents great silicon and packaging integration challenges...
Second-order nonlinear optical processes convert light from one wavelength to another and generate quantum entanglement. Creating chip-scale devices to efficiently control these interactions greatly increases the reach of photonics. Existing silicon-base
“Methods” section for detailed fabrication processes). There is practically no limit in the circuit complexity by vdW integration as long as the transistors are co-planar. For very large-scale integration that requires multiple layers of interconnects, the upper layers can be fabricated by ...
The ITRS scaling of ultra-large-scale integrated circuits requires mechanically robust materials with low k-value. Low-k materials recently used in the Cu/... AU Urbanowicz,K Vanstreels,P Verdonck,... 被引量: 8发表: 2010年 Stress-free polishing advances copper integration with ultralow-k ...
these new high-mobility materials is not mature yet for large-scale integration. The limited success of electronics from these high-mobility materials and well-established Si based high-performance electronics respectively act as the push and pull factors of UTC research. A range of silicon based ...
Figure 1f shows the wafer-scale manufacturability of the flexible artificial synaptic device array, which demonstrates the large-scale integration capability of SWCNTs/ZnTPP phototransistors. Fig. 1: Optical sensor arrays based on the SWCNTs/ZnTPP heterostructure for autonomous driving at different ...