Hybrid bonding技术,也称为DBI技术,即direct bonding interconnect, 芯片间不再通过bump互联。两片wafer在室温下通过氧化物的分子间作用力附着在一起,再通过升温退火,铜发生膨胀并牢固地键合在一起,从而形成电连接。台积电的混合键合技术也称为SoIC (System on Integrated Circuit), 是其3dFabric封装平台中的一个重要技...
TSMC gave an update on its SoIC 3D packaging tech. While they are technically not the industry leaders in hybrid bonding (网页链接{Sony has <4 µm} and soon <1µm in their CMOS image sensors), they are ahead for advanced logic. This new generation appears to be <15 µm TSV int...
重點是,Al pad有傳統填 Via的reflow造成的凹陷,大家可以看圖,這對於後續SoIC hybrid bond封裝的bonding pitch會做不小,因為那個凹陷處在更後面的bonding pad要landing via下來連接時會造成問題,所以他只能避開有via的地方,所以pitch無法縮到很小這一塊跟node沒關,但新的SoIC為了實現更dense 封裝pitch,開始不用Al ...
The 3D SoIC offering provides vertical integration utilizing hybrid bonding between die pads. The die may be oriented in face-to-face or face-to-back configurations. TSVs provide connectivity through the (thinned) die. InFO and CoWoS offerings have been in high-volume production for several years...
A brief explanation for our readers unfamiliar with the terms, SoIC (System on Integrated Chip) is TSMC’s bump-less chip stacking and hybrid bonding integration technology that allows for stacking multiple chip dies together, enabling extremely high-bandwidth and low power bonding between the silico...
通过此次最新合作,Cadence 流程优化了所有 TSMC 最新 3DFabric 供需目录上的产品,包括集成扇出(InFO)、基板上晶圆上芯片(CoWoS)和系统整合芯片(TSMC-SoIC)技术。利用这些设计流程,客户能够加速先进的多芯片封装设计开发,以应对面向新兴的 5G、AI、手机、超大规模计算和物联网应用。
in a 3D-IC at the front end of the line. This can significantly reduce assembly time of multiple layers, sizes, and functions. TSMC contends that its bonding scheme enables faster and shorter connections than other 3D-IC approaches. One report said Apple will begin using TSMC’s SoIC techno...