Transient liquid phase diffusion bonding
In this study, K30 (W 90 wt%, Co 10 wt%) and DX5 (W 84 wt%, Co 16 wt%) tungsten carbide were used as base metals for transient liquid-phase diffusion bonding (TLPDB). The filler metal was MBF20, a type of nickel alloy used to minimize the residual stresses that occur due to...
部分瞬间液相连接,partial transient... ... ) PTLP bonding 部分液相瞬间连接 )transient liquid phase bonding瞬间液相连接... www.dictall.com|基于2个网页 3. 瞬时液相连接 部分瞬间... ... ) transient liquid phase diffusion bonding 瞬间液相扩散连接 )transient liquid phase bonding瞬时液相连接... ...
4) transient liquid phase bonding 瞬时液相扩散连接 1. The geological drill pipe(45MnMoB steel)was joined by transient liquid phase bonding with a novel two-step heating process. 采用瞬时液相扩散连接技术进行了45MnMoB地质钻杆焊接试验,探讨了两种焊接工艺下接头的组织和力学性能。 更多例句>> 5) TLP...
3)transient liquid phase (TLP) diffusion bonding过渡液相(TLP)扩散连接 4)transient liquid phase bonding瞬时液相扩散连接 1.The geological drill pipe(45MnMoB steel)was joined bytransient liquid phase bondingwith a novel two-step heating process.采用瞬时液相扩散连接技术进行了45MnMoB地质钻杆焊接试验,探讨...
Ventzke.Transient liquid phase (TLP) bonding of TiAl using various insert foils.Science and Technology of Welding and Joining. 2004Duan H;Kocak M;Bohm K H;.Transient liquid phase (TLP) bonding of TiAl using various insert foils.Sci Technol Weld Join.2004.513-518...
TiNi shape memory alloy and stainless steel were bonded by transient liquid phase diffusion bonding(TLP-DB)with AgCu metal foil as the interlayer. 采用AgCu金属箔作中间层,对TiNi形状记忆合金与不锈钢进行了瞬间液相扩散焊。 更多例句>> 6) transient liquid phase diffusion bonding(TLPDB) 瞬间液相扩散...
Transient liquid phase diffusion bonding of Ti–22Al–25Nb (at.%) alloy with Ti–15Cu–15Ni (wt.%) was performed. The factors influencing the microstructure and strength of the joints were studied. A suitably long holding time and high bonding temperature would benefit the formation of ...
Transient liquid phase bonding to cold-worked surfaces A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates...
Transient liquid phase (TLP) diffusion bonding of Al-6061 containing 15volpct alumina particles was carried out at 873K (600°C) using electrodeposited nanocomposite coatings as the interlayer. Joint formation was attributed to the solid-state diffusion of Ni into the Al-6061 alloy followed by eu...