The invention relates to a composite preparation technology of inorganic materials and high-polymer materials, and provides a method for reducing the thermal expansion coefficient of PTFE (polytetrafluoroethylene) under the condition that the thermal expansion coefficient of the PTFE is too large. The ...
Furthermore, analysis of variance and response surface graphs were applied to identify the effect of mixture ratio of SGF- and PTFE-reinforced PC composites for the thermal conductivity and thermal expansion coefficient.doi:10.1007/s00521-012-1299-1Hsin-Te Liao...
The bigger the linear expansion coefficient α is, the greater the thermal deformation will be. The thermal deformation is detrimental to the civil engineering. For example, in a large-area or large-volume concrete project, temperature cracks can be caused if the expansion tensile stress is beyond...
a测定材料的热膨胀系数发现添加了20%石墨得PTFE和铜基体的匹配性最好。在实验轧机上测试试制轴承的润滑性能,试验表明添加20%石墨的PTFE润滑性能良好,稳定性好。 The determination material thermal-expansion coefficient discovered increased 20% graphite to result in PTFE and the copper substrate match is best.In...
The current challenge with the application of these coatings is still the coefficient of thermal expansion mismatch between the brittle alumina ceramic layer and the metal alloy coating and the steel substrate. This can result in evolution of thermal stresses and formation of microcracks in alumina, ...
In addition, the material may have a greater coefficient of thermal expansion than copper. As a result, it will cause durability problems when drilling into polyimide. Chip Load: Chip load on the drill bit will affect how quickly it will wear. A high chip load helps generate friction and ...
The Effects of Filler Content and Size on the Properties of PTFE/SiO2 Composites Composites with different sizes of filler showed a similar trend of decreasing tensile strength and coefficient of thermal expansion (CTE z ), and ... YC Chen,HC Lin,YD Lee - 《Journal of Polymer Research》 被...
The thermal expansion coefficient of the laminates and printed circuit boards in Z-direction to prevent disconnection of circuits between layers and an increase in conductor resistivity should preferably be 100 ppm/° C. or less, particularly 50 ppm/° C. When copper is used for the circuits, t...
A variety of fine-grained metallic coatings, which at room temperature have a coefficient of thermal expansion in the range between −5.0×10−6 K−1 and 25×10−6 K−1, can be employed. Particularly suited are fine-grained high-strength pure metals or alloys containing one of Al,...
An additional way in which the reliability of the Peltier heaters 40 is improved is by matching the thermal coefficient of expansion of the materials used for the structural components surrounding the Peltier heaters 40. Specifically, the thermal block plate 22, the spacer bracket 46, and the ...